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This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

The purpose of this paper is to investigate and quantify the impact of product complexity, including architectural complexity, on operator learning, productivity and quality performance in both assembly and disassembly operations. This topic has not been extensively investigated in previous research.

An extensive experimental campaign involving 84 operators was conducted to repeatedly assemble and disassemble six different products of varying complexity to construct productivity and quality learning curves. Data from the experiment were analysed using statistical methods.

The human learning factor of productivity increases superlinearly with the increasing architectural complexity of products, i.e. from centralised to distributed architectures, both in assembly and disassembly, regardless of the level of overall product complexity. On the other hand, the human learning factor of quality performance decreases superlinearly as the architectural complexity of products increases. The intrinsic characteristics of product architecture are the reasons for this difference in learning factor.

The results of the study suggest that considering product complexity, particularly architectural complexity, in the design and planning of manufacturing processes can optimise operator learning, productivity and quality performance, and inform decisions about improving manufacturing operations.

While previous research has focussed on the effects of complexity on process time and defect generation, this study is amongst the first to investigate and quantify the effects of product complexity, including architectural complexity, on operator learning using an extensive experimental campaign.

The purpose of this paper is to present an alternative solution for press-fit technology processes, which could improve the precision of the positioning movements and the stiffness of the structural elements.

A concept is presented and the related kinematics is described. Then, preliminary embodiment evaluations have been performed in terms of kinematics, force control and load distribution on the main structural elements.

Thanks to the additional leg, the proposed solution allows a preload that is capable of compensating the backlash of joints. The particular structure with four extendible legs and eight cardan joints ensures the parallelism between the ground and the plate holding the end effector, without any need of additional controls. However, it implies that the legs are not subjected to pure tension–compression stresses.

This work is focused on the conceptual phase of the design process, with only preliminary embodiment analysis that paves the way for subsequent and more detailed design steps. Especially concerning the actual stiffness of the system, comprehensive evaluations could be performed only after the identification of the particular parts/devices used to implement the main functional elements.

To the best of the authors’ knowledge, this is the first research work that comprehensively describes and analyzes the considered kinematics, within a real industrial application context.