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The purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.

This new finish utilises nanotechnology and is based on a new formulation of the “organic metal” (OM).

The final surface finish is an approximately 50 nm thin permanent layer, consisting of a complex between the OM and silver (Ag). Panels finished with OrmeSTAR™ Ultra show excellent solderability in spite of a low‐layer thickness and therefore offer significant advantages over existing surface finishes.

This new finish has proven to be a competitive alternative to current final finishes with excellent properties for soldering applications. The new nanotechnology can also significantly improve the environmental and economical consequences of solderable surface finishing.

Various methods are described of making separable electrical connections to MID structures. The first part discusses the use of a copper plated, glass filled plastic substrate as a contact surface. It is shown that the morphology is different from that of conventional contacts due to the presence of dendritic growths, further that mechanical properties like stiffness and strength are lower than for solid copper. The second part discusses the application of two conventional techniques ‐ elastromeric connectors and compliant pins. Elastomeric connectors are designed to form a high density, separable interface using gold plated conductors. Compliant pins pressed into plated‐through holes form very reliable, high normal force connections without the need for noble metal plating. Two compliant pin designs have been tested with plated holes in two versions, moulded and drilled. All combinations show excellent electrical stability; however, differences were found in mechanical behaviour between the various pin and hole combinations.

Circuit Technology, now in its fourth year, is still an event concentrating exclusively on PCB technology, production equipment and processes. Nevertheless, the organisers believe that Circuit Technology '86 will derive great benefit from participation in the UK's largest electronics gathering, The British Electronics Week.

The purpose of this paper is to design an automatic press-fit instrument to realize precision assembly and connection quality assessment of a small interference fitting parts, armature.

In this paper, an automatic press-fit instrument was developed for the technical problems of reliable clamping and positioning of the armature, automatic measurement and adjustment of the attitude and evaluation of the connection quality. To compensate for the installation error of the equipment, corresponding calibration method was proposed for each module of the instrument. Assembly strategies of axial displacement and perpendicularity were also proposed to ensure the assembly accuracy. A theoretical model was built to calculate the resistant force generated by the non-contact regions and then combined with the thick-walled cylinder theory to predict the press-fit curve.

The calibration method and assembly strategy proposed in this paper enable the press-fit instrument to achieve good alignment and assembly accuracy. A reasonable range of press-fit curve obtained from theoretical model can achieve the connection quality assessment.

This instrument has been used in an armature assembly project. The practical results show that this instrument can assemble the armature components with complex structures automatically, accurately, in high-efficiency and in high quality.

This paper provides a technical method to improve the assembly quality of small precision interference fitting parts and provides certain methodological guidelines for precision peg-in-hole assembly.

To address the lack of data in this field and determine the relationship between the coefficient of friction and the interference between locomotive wheels and axles, this study evaluates the theoretical relationship between the coefficient of friction and the interference under elastic deformation.

When using numerical analyses to study the mechanical state of the contacting components of the wheels and axle, the interference between the axle parts and the coefficient of friction between the axle parts are two important influencing factors. Currently, as the range of the coefficient of friction between the wheel and axle in interference remains unknown, it is generally considered that the coefficient of friction is only related to the materials of the friction pair; the relationship between the interference and the coefficient of friction is often neglected.

A total of 520 press-fitting experiments were conducted for 130 sets of wheels and axles of the HXD2 locomotive with 4 types of interferences, in order to obtain the relationship between the coefficient of friction between the locomotive wheel and axle and the amount of interference. These results are expected to serve as a reference for selecting the coefficient of friction when designing axle structures with the rolling stock, research on the press-fitting process and evaluations of the fatigue life.

The study provides a basis for the selection of friction coefficient and interference amount in the design of locomotive wheels and axles.

The purpose of this paper is to form high density interconnection (HDI) of backboard for press-fit applications with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste should be found to obtain good electrical and physical performance of the conductive paste and avoid the simultaneous curing behavior of prepreg.

A novel structure of backboard was designed by using the connection of conductive paste-filled through holes to connect two multilayers. Pre-curing conditions of conductive paste were investigated to find their effects on resistance, bond strength and volume shrinkage. The reliability of pre-curing conductive paste was also analyzed.

Pre-curing conditions led to a great influence on the resistance, bond strength and volume shrinkage of the conductive paste. The best condition of pre-curing conductive paste was chosen as the low curing temperature of 60°C and a curing time of 30 min. Cured conductive paste exhibited square resistance of 4.205 mΩ/□ and bonding strength of 22.86 N. The as-obtained pre-curing condition could improve the reliability of conductive paste. Pre-curing process of conductive paste at extremely low temperature to interconnect two multilayer structures improved the density interconnection of backboard for press-fit applications.

The use of HDI of backboard could lead to good assembly for high-speed signal transmission of electronic products with press-fitting components. The connection of pre-curing conductive paste for multilayers could have important function for improving the application for communication backboard.

The purpose of this paper is to present an alternative solution for press-fit technology processes, which could improve the precision of the positioning movements and the stiffness of the structural elements.

A concept is presented and the related kinematics is described. Then, preliminary embodiment evaluations have been performed in terms of kinematics, force control and load distribution on the main structural elements.

Thanks to the additional leg, the proposed solution allows a preload that is capable of compensating the backlash of joints. The particular structure with four extendible legs and eight cardan joints ensures the parallelism between the ground and the plate holding the end effector, without any need of additional controls. However, it implies that the legs are not subjected to pure tension–compression stresses.

This work is focused on the conceptual phase of the design process, with only preliminary embodiment analysis that paves the way for subsequent and more detailed design steps. Especially concerning the actual stiffness of the system, comprehensive evaluations could be performed only after the identification of the particular parts/devices used to implement the main functional elements.

To the best of the authors’ knowledge, this is the first research work that comprehensively describes and analyzes the considered kinematics, within a real industrial application context.