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Considering the limited understanding of determinants influencing the adoption of smart mobile tourism app (SMTA) featuring augmented reality (AR) and big data analytics (BDA), privacy concern (PC) and the risk of privacy information disclosure (PI) have threatened SMTA adoption. This study aims to propose an expanded consumer acceptance and use of information technology (UTAUT2) model by including new contextual components, integrated with privacy calculus theory (PCT) model to examine the determinants influencing behavioural intention (BI) to use SMTA.

Personal innovativeness (IN) and privacy information disclosure (PI) are incorporated in UTAUT2 model to determine its effect on SMTA featuring AR and BDA technologies from smart perspective. Both privacy concern (PC) and privacy risk (PR) derived from PCT model are also included to determine its influences on an individual's willingness to disclose privacy information for better-personalised services. We collected responses from 392 targeted participants, resulting in a strong response rate of 84.66%. These responses were analysed statistically using structural equation modeling in both SPSS 22.0 and SmartPLS 3.0.

Findings showed that personal innovativeness (IN), habit (HT) and performance expectancy (PE) significantly affect behavioural intention (BI) while privacy concern (PC) significantly affect privacy information disclosure (PI) to use SMTA. In contrast, effort expectancy (EE), hedonic motivation (HM) and privacy information disclosure (PI) had no significant effects on behavioural intention (BI) while privacy risk (PR) had no significant effects on privacy information disclosure (PI) to use SMTA.

The study findings help tourism practitioners in better comprehending recent trends of SMTA adoption for establishing targeted marketing strategies on apps to improve service quality. In addition, it enables app development companies acquire app users’ preferences to enhance their app development for leading app usage.

This study aims to investigate the effect of incorporating cobalt (Co) into Sn-58Bi alloy on its phase composition, tensile properties, hardness and thermal aging performances. The fracture morphologies of tensile-tested solders are also investigated to correlate the microstructural changes with tensile properties of the solder alloys. Then, the thermal aging performances of the solder alloys are investigated in terms of their intermetallic compound (IMC) layer morphology and thickness.

The Sn-58Bi and Sn-58Bi-xCo, where x = 1.0, 1.5 and 2.0 Wt.%, were prepared using the flux doping technique. X-ray diffraction (XRD) is used to study the phase composition of the solder alloys, whereas scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) are used to investigate the microstructure, fractography and compositions of the solders. Tensile properties such as ultimate tensile strength (UTS), Young’s modulus and elongation are tested using the tensile test, whereas the microhardness value is gained from the micro-Vickers hardness test. The morphology and thickness of the IMC layer at the solder’s joints are investigated by varying the thermally aging duration up to 56 days at 80°C.

XRD analysis shows the presence of Co₃Sn₂ phase and confirms that Co was successfully incorporated via the flux doping technique. The microstructure of all Sn-58Bi-xCo solders did not differ significantly from Sn-58Bi solders. Sn-58Bi-2.0Co solder exhibited optimum properties among all compositions, with the highest UTS (87.89 ± 2.55 MPa) at 0.01 s⁻¹ strain rate and the lowest IMC layer thickness at the interface after being thermally aged for 56 days (3.84 ± 0.67 µm).

The originality and value of this research lie in its novel exploration of the flux doping technique to introduce minor alloying of Co into Sn-58Bi solder alloys, providing new insights into enhancing the properties and performance of these solders. This new Sn-Bi-Co alloy has the potential to replace lead-containing solder alloy in low-temperature soldering.