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Extrusion width, the width of printed filaments, affects multiple critical aspects in mechanical properties in material extrusion additive manufacturing: filament geometry, interlayer load-bearing bonded area and fibre orientation for fibre-reinforced composites. However, this study aims to understand the effects of extrusion width on 3D printed composites, which has never been studied systematically.

Four polymers with and without short-fibre reinforcement were 3D printed into single-filament-wide specimens. Tensile properties, mechanical anisotropy and fracture mechanisms were evaluated along the direction of extruded filaments (F) and normal to the interlayer bond (Z). Extrusion width, nozzle temperature and layer height were studied separately via single-variable control. The extrusion width was controlled by adjusting polymer flow in the manufacturing procedure (gcode), where optimisation can be achieved with software/structure design as opposed to hardware.

Increasing extrusion width caused a transition from brittle to ductile fracture, and greatly reduced directional anisotropy for strength and ductility. For all short fibre composites, increasing width led to an increase in strain-at-break and decreased strength and stiffness in the F direction. In the Z direction, increasing width led to increased strength and strain-at-break, and stiffness decreased for less ductile materials but increased for more ductile materials.

The transformable fracture reveals the important role of extrusion width in processing-structure-property correlation. This study reveals a new direction for future research and industrial practice in controlling anisotropy in additive manufacturing. Increasing extrusion width may be the simplest way to reduce anisotropy while improving printing time and quality in additive manufacturing.

The lightweight design of aircraft seats can significantly improve fuel efficiency and reduce greenhouse gas emissions. Metal additive manufacturing (MAM) can produce lightweight topology-optimized designs with improved performance, but limited build volume restricts the printing of large components. The purpose of this paper is to design a lightweight aircraft seat leg structure using topology optimization (TO) and MAM with build volume restrictions, while satisfying structural airworthiness certification requirements.

TO was used to determine a lightweight conceptual design for the seat leg structure. The conceptual design was decomposed to meet the machine build volume, a detailed CAD assembly was designed and print orientation was selected for each component. Static and dynamic verification was performed, the design was updated to meet the structural requirements and a prototype was manufactured.

The final topology-optimized seat leg structure was decomposed into three parts, yielding a 57% reduction in the number of parts compared to a reference design. In addition, the design achieved an 8.5% mass reduction while satisfying structural requirements for airworthiness certification.

To the best of the authors’ knowledge, this study is the first paper to design an aircraft seat leg structure manufactured with MAM using a rigorous TO approach. The resultant design reduces mass and part count compared to a reference design and is verified with respect to real-world aircraft certification requirements.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.