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1 – 10 of 212
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42

Abstract

Details

Microelectronics International, vol. 17 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 December 2000

78

Abstract

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Circuit World, vol. 26 no. 4
Type: Research Article
ISSN: 0305-6120

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Content available
Article
Publication date: 1 June 2004

108

Abstract

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Aircraft Engineering and Aerospace Technology, vol. 76 no. 3
Type: Research Article
ISSN: 0002-2667

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Content available
Article
Publication date: 1 October 2002

211

Abstract

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International Journal of Clothing Science and Technology, vol. 14 no. 5
Type: Research Article
ISSN: 0955-6222

Content available
Article
Publication date: 1 June 2003

Brian Ellis

59

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Circuit World, vol. 29 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 March 2013

244

Abstract

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Industrial Robot: An International Journal, vol. 40 no. 2
Type: Research Article
ISSN: 0143-991X

Open Access
Article
Publication date: 12 May 2020

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek and Sebastian Wroński

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…

2486

Abstract

Purpose

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

Design/methodology/approach

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

Findings

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

Originality/value

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Details

Soldering & Surface Mount Technology, vol. 32 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 7 December 2021

Ayşegül Akçay Kavakoğlu, Derya Güleç Özer, Débora Domingo-Callabuig and Ömer Bilen

The paper aims to examine the concept of architectural design communication (ADC) for updating design studio dynamics in architectural education during the Covid-19 pandemic…

1064

Abstract

Purpose

The paper aims to examine the concept of architectural design communication (ADC) for updating design studio dynamics in architectural education during the Covid-19 pandemic. Within this perspective, the changing and transforming contents of architectural education, the thinking, representation and production mediums are examined through the determined components of ADC. There are five components in the study, which are (1) Effective Language Use, (2) Effective use of Handcrafts, (3) Effective Technical Drawing Knowledge, (4) Effective Architectural Software Knowledge and (5) Outputs.

Design/methodology/approach

The research method is based on qualitative and quantitative methods; a survey study is applied and the comparative results are evaluated with the path analysis method. The students in the Department of Architecture of two universities have been selected as the target audience. Case study 1 survey is applied to Altinbas University (AU) and Case study 2 survey is applied to Universitat Politecnica de Valencia (UPV) students during the COVID-19 pandemic; ‘19-‘20 spring term, online education.

Findings

As a result, two-path analysis diagrams are produced for two universities, and a comparative analysis is presented to reveal the relationships of the selected ADC components.

Originality/value

This paper fulfills an identified need to study how ADC can be developed in online education platforms.

Content available
Article
Publication date: 1 February 2002

44

Abstract

Details

Industrial Lubrication and Tribology, vol. 54 no. 1
Type: Research Article
ISSN: 0036-8792

Keywords

Content available
Article
Publication date: 1 September 2000

307

Abstract

Details

Sensor Review, vol. 20 no. 3
Type: Research Article
ISSN: 0260-2288

Keywords

1 – 10 of 212