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The Research Libraries Group, Inc. (RLG), a nationwide consortium of research institutions, operates the Research Libraries Information Network (RLIN), an information system and communications network that supports RLG's cooperative programs as well as the technical processing and public services requirements of research libraries. Changes in communications technology, in the regulatory environment, and in user requirements have led RLG to redesign its communications network. The goals, topology, hardware, software and protocols, deployment, and related matters are discussed. Sidebars address current RLIN communications technology and the integrated RLIN network.

This paper aims to develop 3D-printed customized padding to increase pressure at the zero pressure region. This padding is specifically intended for facial areas with complex contours in pressure therapy treatment of hypertrophic scars.

To carry out this study, a full-face head garment was fabricated by a local occupational therapist, and pressure measurements were conducted to establish the pressure exerted by this head garment and to determine the zero pressure region. Furthermore, an additional manufacturing method was used to construct customized padding, and pressure measurements were performed to measure the pressure exerted after application of this customized padding.

The results reveal that 3D-printed customized padding can increase pressure at the zero pressure region, which occurs on complex contour surfaces with a spatial gap because of non-contact of the head garment and facial surfaces.

This paper suggests that an additive manufacturing method using 3D printing is capable of producing accurate, functional and low-cost medical parts for rehabilitation. Moreover, the 3D-printed padding fabricated by additive manufacturing assists in generating optimal pressure, which is necessary for effective pressure therapy.

Digital design using 3D scanning, computer-aided design and 3D printing is capable of designing and producing properly fitting, customized padding that functions to increase pressure from zero to an acceptable pressure range required for pressure therapy.

The paper aims to present an innovative method for imaging the pressure distribution between two interface surfaces. The physical principles behind the design of the pressure imaging system are explained, and some case studies involving the use of this technology in diverse applications are described.

The XSENSOR pressure sensor is comprised of a matrix of capacitive sensing elements. Pressure applied to the surface of the sensing element causes a change in capacitance that is correlated to a change in pressure. Proprietary Windows based software compensates for sensor non‐linearity, hysteresis, and creep over time, resulting in enhanced accuracy.

XSENSOR's capacitive based pressure imaging sensors can graphically display pressure distributions in real time between virtually any two surfaces in contact. The sensor element is accurate, thin, flexible, and robust. These physical characteristics minimize any artificial influences created by the presence of the sensor during data collection.

Pressure imaging technology can be used in industrial and engineering environments for product design and verification, process control, or quality assurance.

This paper will be useful to the engineer or business manager interested in applying sensor technology to solve engineering or design problems.

The purpose of this study on architecture, design, ergonomics and anthropometry was to ensure compliance with the human-machine-work environment, minimize human error and obtain anthropometric measurements accurately, safely and rapidly.

The developed system efficiently extracted anthropometric data for 15,243 individuals with an accuracy rate of 98.8 per cent, focusing on the values for “shoulder breath” and “body depth.” In this study, a new anthropometric measurement system was developed and subsequently applied to obtain anthropometric measurements easily and quickly. The effect of the newly collected anthropometric data on the design discipline was evaluated.

The findings highlighted the need to update the anthropometric data used in other design studies. In addition to contributing to designing discipline, the updated anthropometric data are considered suitable for use in many different fields.

The design discipline and related disciplines are expected to take advantage of these measurements. Updating the aforementioned data will also be easier and faster because of the simplicity and affordability of the system.

This is the first and only such study in Turkey with regard to the up-to-date anthropometric measurements obtained and the size of the database created.

Operating at the crossroads of higher education, librarianship, technology application, and service delivery, the Research Libraries Group (RLG) is a powerful partner to institutional efforts. For 20 years, it has identified critical research needs, provided responsive solutions, and expanded access to new and untapped information resources. With its highly skilled staff, sophisticated technical resources, and successful track record in managing and supporting interactions among its members, RLG is well positioned to help research institutions address the information challenges of the 1990s.

The purpose of this paper is to describe a local melt process of solder bumping employed in electronic packaging applications by an induction heating reflow method, for a combined numerical and experimental study involving a temperature measurement using an infrared thermometer during the reflow process and microstructural observations after reflow, which can be used to control the height and shape of solder interconnects.

In the induction heating reflow process, the temperature distribution within the solder ball during the heating phase is of prime importance for the success of the process and the geometry control quality of final joints. This paper investigates the local melt process of solder balls reflowed onto Cu/Ni/Au pads, and focuses on the effect of the inductive heat on the thermal distribution during the melting process. A finite‐element model is applied to simulate the thermal field in a solder bump during the induction heating period in a reflow process. The effects of the coil current and the electromagnetic frequency on the thermal performance are investigated by using the validated thermal model. The local melt phenomenon in the solder joint is observed and identified by the microstructures taken using scanning electron microscopy.

In this paper, the numerical results match the experimental results quite well to validate the finite element modeling model. The local melt phenomenon predicted by simulation, and verified by experiments, is demonstrated to be capable of controlling the solder joint shape. Several parametric studies are carried out to understand the effects of different frequencies during assembly, and to suggest that a higher frequency is easier to get a greater temperature gradient, thus a more obvious local melt phenomenon, which is good for achieving the geometry control for solder joints.

The findings of this paper will help to understand the detailed solder bumping process during induction heating reflow and the effects of electromagnetic field frequency on solder joint shape controlling.

The Electroplating Products and Equipment Business Area of Degussa AG, Frankfurt am Main, Federal Republic of Germany, has begun to supply a new selective electroplating plant. Under a co‐operation agreement with the Telmec company of Milan, Italy, this business area of Degussa, which is based in Schwäbisch Gmüd, Germany, has begun to market the Telmec SL 6 ‘Tab Plater’ throughout the world, with the exception of Italy and France. The equipment was developed specially for manufacturers of printed circuit boards, and is used for the continuous electroplating of strip contacts on these boards.