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Microstructure-sensitive design (MSD), for optimal performance of engineering components that are sensitive to material anisotropy, has largely been confined to the realm of theory. The purpose of this paper is to insert the MSD framework into a finite element environment in order to arrive at a practical tool for improved selection and design of materials for critical engineering situations.

This study applies the recently developed Hybrid Bishop-Hill (HBH) model to map the yield surface of anisotropic oxygen free electronic copper. Combining this information with the detailed local stresses determined via finite element analysis (FEA), a “configurational yield stress” is determined for the entire component. By varying the material choice/processing conditions and selecting the directionality of anisotropy, an optimal configuration is found.

The paper provides a new FEA-based framework for MSD for yield-limited situations. The approach identified optimal directionality and processing configurations for three engineering situations that are particularly sensitive to material anisotropy.

The microstructure design space for this study is limited to a selection of eight copper materials produced by a range of processing methods, but is generalizable to many materials that exhibit anisotropic behavior.

The introduction of MSD methodology into a finite element environment is a first step toward a comprehensive designer toolkit for exploiting the anisotropy of general materials (such as metals) in a way that is routinely undertaken in the world of fiber-based composite materials. While the gains are not as sizeable (due to the less-extreme anisotropy), in many applications they may be extremely important.