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The novelty addressed here is undertaken by using tailor-made and fully characterized starch nanoparticles (SNPs) having a particle size ranging from 80 to 100 nm with a larger surface area, biodegradability and high reactivity as a starting substrate for cadmium ions and basic dye removal from wastewater effluent. This was done via carboxylation of SNPs with citric acid via esterification reaction using the dry preparation technique, in which a simple, energy-safe and sustainable process concerning a small amount of water, energy and toxic chemicals was used. The obtained adsorbent is designated as cross-linked esterified starch nanoparticles (CESNPs).

The batch technique was used to determine the CESNPs adsorption capacity, whereas atomic adsorption spectrometry was used to determine the residual cadmium ions concentration in the filtrate before and after adsorption. Different factors affecting adsorption were examined concerning pH, contact time, adsorbent dose and degree of carboxylation. Besides, to validate the esterification reaction and existence of carboxylic groups in the adsorbent, CESNPs were characterized metrologically via analytical tools for carboxyl content estimation and instrumental tools using Fourier-transform infrared spectroscopy (FTIR) spectra and scanning electron microscopy (SEM) morphological analysis.

The overall adsorption potential of CESNPs was found to be 136 mg/g when a 0.1 g adsorbent dose having 190.8 meq/100 g sample carboxyl content at pH 5 for 60 min contact time was used. Besides, increasing the degree of carboxylation of the CESNPs expressed as carboxyl content would lead to the higher adsorption capacity of cadmium ions. FTIR spectroscopy analysis elucidates the esterification reaction with the appearance of a new intense peak C=O ester at 1,700 cm⁻¹, whereas SEM observations reveal some atomic/molecules disorder after esterification.

The innovation addressed here is undertaken by studying the consequence of altering the extent of carboxylation reaction expressed as carboxyl contents on the prepared CESNPs via a simple dry technique with a small amount of water, energy and toxic chemicals that were used as a sustainable bio nano polymer for cadmium ions and basic dye removal from wastewater effluent in comparison with other counterparts published in the literature.

The purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By comparing the bending radius and strength across differently sized and treated chips, the study sought to understand the underlying mechanics that contribute to the flexibility of silicon-based electronic devices. This understanding is crucial for the development of advanced, robust and adaptable electronic systems that can withstand the rigors of manufacturing and everyday use.

This study explores the impact of silicon chip geometry and surface defects on flexibility through a multifaceted experimental approach. The methodology included preparing silicon chips of three distinct dimensions and subjecting them to thinning processes to achieve a uniform thickness verified via scanning electron microscopy (SEM). Finite element method (FEM) simulations and a series of four-point bending tests were used to analyze the bending flexibility theoretically and experimentally. The approach was comprehensive, examining both the intrinsic geometric factors and the extrinsic influence of surface defects induced by manufacturing processes.

The findings revealed a significant deviation between the theoretical predictions from FEM simulations and the experimental outcomes from the four-point bending tests. Rectangular-shaped chips demonstrated superior flexibility, with smaller dimensions leading to an increased bending strength. Surface defects, identified as critical factors affecting flexibility, were analyzed through SEM and atomic force microscopy, showing that etching processes could reduce defect density and enhance flexibility. Notably, the study concluded that surface defects have a more pronounced impact on silicon chip flexibility than geometric factors, challenging initial assumptions and highlighting the need for defect minimization in chip manufacturing.

This research contributes valuable insights into the design and fabrication of flexible electronic devices, emphasizing the significant role of surface defects over geometric considerations in determining silicon chip flexibility. The originality of the work lies in its holistic approach to dissecting the factors influencing silicon chip flexibility, combining theoretical simulations with practical bending tests and surface defect analysis. The findings underscore the importance of optimizing manufacturing processes to reduce surface defects, thereby paving the way for the creation of more durable and flexible electronic devices for future technologies.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

This study aims to evaluate the development of composites made of epoxy (E) resin with different weight percentages of polypropylene (PP) and graphene oxide (Go) to form nanocomposite plates.

A hand lay-up process was used to develop 21 different composites, with varying concentrations of PP (5%–35%) and Go (5%–35%). A ternary composite of E matrix was produced by combining binary fillers PP and Go (5%–35%) in a 1:1 ratio to a (95%–5%) solution. With the help of adopting the melt condensation deal to extract Go, the modified Hummers method was used to make Go platelets.

Through field emission scanning electron microscopy (FESEM) and X-ray diffraction investigations, the particulate’s size and structural characteristics were identified. Based on the FESEM analysis of the collapsed zones of the composites, a warp-and-weft-like structure is evident, which endorses the growth yield strength, flexural modulus and impact strength of the composites.

The developed nanocomposites have exceptional mechanical capabilities compared to plain E resin, with E resin exhibiting better tensile strength, modulus and flexural strength when combined with 10% PP and 10% Go. When compared to neat E resin, materials formed from composites have exceptional mechanical properties. When mixed with 10% PP and 10% Go, E resin in particular displays improved tensile strength (23 MPa), tensile modulus (4.15 GPa), flexural strength (75.6 MPa) and other attributes. Engineering implications include automobile side door panels, spacecraft applications, brake pads and flexible battery guards.

This study’s aim is to introduce a high-performance sorbent for the removal of both anionic (Congo red; CR) and cationic (methylene blue; MB) dyes from aqueous solutions.

Sodium silicate is adopted as a substrate for GO and AgNPs with positive charge are used as modifiers. The synthesized nanocomposite is characterized by FTIR, FESEM, EDS, BET and XRD techniques. Then, some of the most effective parameters on the removal of CR and MB dyes such as solution pH, sorbent dose, adsorption equilibrium time, primary dye concentration and salt effect are optimized using the spectrophotometry technique.

The authors successfully achieved notable maximum adsorption capacities (Qmax) of CR and MB, which were 41.15 and 37.04 mg g⁻¹, respectively. The required equilibrium times for maximum efficiency of the developed sorbent were 10 and 15 min for CR and MB dyes, respectively. Adsorption equilibrium data present a good correlation with Langmuir isotherm, with a correlation coefficient of R2 = 0.9924 for CR and R2 = 0.9904 for MB, and kinetic studies prove that the dye adsorption process follows pseudo second-order models (CR R2 = 0.9986 and MB R2 = 0.9967).

The results showed that the proposed mechanism for the function of the developed sorbent in dye adsorption was based on physical and multilayer adsorption for both dyes onto the active sites of non-homogeneous sorbent.

The as-prepared nano-adsorbent has a high ability to remove both cationic and anionic dyes; moreover, to the high efficiency of the adsorbent, it has been tried to make its synthesis steps as simple as possible using inexpensive and available materials.

This paper aims to explore the influence of corrosion-deformation interactions (CDI) on the corrosion behavior and mechanisms of 316LN under applied tensile stresses.

Corrosion of metals would be aggravated by CDI under applied stress. Notably, the presence of nitrogen in 316LN austenitic stainless steel (SS) would enhance the corrosion resistance compared to the nitrogen-absent 316L SS. To clarify the CDI behaviors, electrochemical corrosion experiments were performed on 316LN specimens under different applied stress levels. Complementary analyses, including three-dimensional morphological examinations by KH-7700 digital microscope and scanning electron microscopy coupled with energy dispersive spectroscopy, were conducted to investigate the macroscopic and microscopic corrosion morphology and to characterize the composition of corrosion products within pits. Furthermore, ion chromatography was used to analyze the solution composition variations after immersion corrosion tests of 316LN in a 6 wt.% FeCl₃ solution compared to original FeCl₃ solution. Electrochemical experiment results revealed the linear decrease in free corrosion potential with increasing applied stress. Electrochemical impedance spectroscopy results indicated that high tensile stress level damaged the integrity of passivation film, as evidenced by the remarkable reduction in electrochemical impedance. Ion chromatography analyses proved the concentrations increase of NO₃⁻ and NH₄⁺ ion concentrations in the corrosion media after corrosion tests.

The enhanced corrosion resistance of 316LN SS is attributable to the presence of nitrogen.

The scope of this study is confined to the influence of tensile stress on the electrochemical corrosion of 316LN at ambient temperatures; it does not encompass the potential effects of elevated temperatures or compressive stress.

The resistance to stress electrochemical corrosion in SS may be enhanced through nitrogen alloying.

This paper presents a systematic investigation into the stress electrochemical corrosion of 316LN, marking the inaugural study of its impact on corrosion behaviors and underlying mechanisms.

This paper aims to examine the association between the dietary inflammatory index, the consumption of Enteral Nutrition Supplemented with probiotics with certain serum inflammation markers and gastrointestinal complications among individuals diagnosed with COVID-19.

This cross-sectional investigation involved 100 COVID-19 patients who were admitted to intensive care units in hospitals. These patients were administered two different types of Enteral Nutrition, so the dietary inflammatory index (DII), gastrointestinal complications and some serum inflammation markers have been compared between two groups.

The mean DII scores in all patients were significantly pro-inflammatory (probiotic formula 2.81 ± 0.01 vs usual formula group 2.93 ± 0.14 p = 0.19). The probiotic formula consumption had an inverse association with High-sensitivity C-reactive Protein concentration (coef = −3.19, 95% CI −1.25, −5.14 p = 0.001) and lead to a reduction of 2.14 mm/h in the serum level of Erythrocyte sedimentation rate compared to normal formula. The incidence of diarrhea, abdominal pain and vomiting in probiotic formula patients was respectively 94%, 14% and 86% less than in usual formula patients (p = 0.05).

In this cross-sectional study for the first time, the authors found that probiotic formula consumption was inversely associated with serum inflammation markers and gastrointestinal complications incidence. The high DII leads to more gastrointestinal complications incidence and inflammation markers. More studies are needed to prove this relationship.