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Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints.

The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data.

Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%.

The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.

This paper is supposed to provide a critical review of current research progress on thermal management in grinding of superalloys, and future directions and challenges. By understanding the current progress and identifying the developing directions, thermal management can be achieved in the grinding of superalloys to significantly improve the grinding quality and efficiency.

The relevant literature is collected from Web of Science, Scopus, CNKI, Google scholar, etc. A total of 185 literature is analyzed, and the findings in the literature are systematically summarized. In this case, the current development and future trends of thermal management in grinding of superalloys can be concluded.

The recent developments in grinding superalloys, demands, challenges and solutions are analyzed. The theoretical basis of thermal management in grinding, the grinding heat partition analysis, is also summarized. The novel methods and technologies for thermal management are developed and reviewed, i.e. new grinding technologies and parameter optimization, super abrasive grinding wheel technologies, improved lubrication, highly efficient coolant delivery and enhanced heat transfer by passive thermal devices. Finally, the future trends and challenges are identified.

Superalloys have excellent physical and mechanical properties, e.g. high thermal stability, and good high-temperature strength. The superalloys have been broadly applied in the aerospace, energy and automobile industries. Grinding is one of the most important precision machining technologies for superalloy parts. Owing to the mechanical and physical properties of superalloys, during grinding processes, forces are large and a massive heat is generated. Consequently, the improvement of grinding quality and efficiency is limited. It is important to conduct thermal management in the grinding of superalloys to decrease grinding forces and heat generation. The grinding heat is also dissipated in time by enhanced heat transfer methods. Therefore, it is necessary and valuable to holistically review the current situation of thermal management in grinding of superalloys and also provide the development trends and challenges.

Heritage building management serves as a potent catalyst for sustainability, yet it poses a distinctive set of challenges. Achieving a harmonious balance between conserving the building's historical and cultural value and ensuring modern functionality and safety remains a primary concern. The present work proposes a socio-technical approach to the development and use of a digital twin (DT) that will integrate social data related to the use of heritage buildings with building and environmental data.

The paper presents a logical and systematic joined-up management framework to the targeted heritage buildings, according to a “Whole Building” approach. Our approach is informed by the underpinning assumption that a heritage building and even more a heritage neighborhood is a socio-technical, complex and dynamic system, the change of which depends on the dynamic interconnections of materials, competences, resources, values, space/environment, senses and time.

A heritage dynamics approach is adopted to unfold the dynamic nature of heritage and to better inform decisions that can be made in the present and future, achieving people-centered and place-based heritage management. This proposition underlines the heritage transformation as a complex systemic process that consists of nonlinear interconnections of multiple heterogeneous factors (values, senses, attitudes, spaces and resources).

This paper presents a multi-level framework of DTs that interact hierarchically to comprehensively understand, assimilate and seamlessly integrate intricate contexts, even when faced with conflicting conditions from diverse cultural heritage entities. This paper outlines the importance of the iterative system dynamics (SD) approach, which enables adaptive management and ensures the resilience of cultural heritage over time.

This study aims to investigate crack propagation in a moisture-preconditioned soft-termination multi-layer ceramic capacitor (MLCC) during thermal reflow process.

Experimental and extended finite element method (X-FEM) numerical analyses were used to analyse the soft-termination MLCC during thermal reflow. A cross-sectional field emission scanning electron microscope image of an actual MLCC’s crack was used to validate the accuracy of the simulation results generated in the study.

At 270°C, micro-voids between the copper-electrode and copper-epoxy layers absorbed 284.2 mm/mg³ of moisture, which generated 6.29 MPa of vapour pressure and caused a crack to propagate. Moisture that rapidly vaporises during reflow can cause stresses that exceed the adhesive/substrate interface’s adhesion strength of 6 MPa. Higher vapour pressure reduces crack development resistance. Thus, the maximum crack propagation between the copper-electrode and copper-epoxy layers at high reflow temperature was 0.077 mm. The numerical model was well-validated, as the maximum crack propagation discrepancy was 2.6%.

This research holds significant implications for the industry by providing valuable insights into the moisture-induced crack propagation mechanisms in soft-termination MLCCs during the reflow process. The findings can be used to optimise the design, manufacturing and assembly processes, ultimately leading to enhanced product quality, improved performance and increased reliability in various electronic applications. Moreover, while the study focused on a specific type of soft-termination MLCC in the reflow process, the methodologies and principles used in this research can be extended to other types of MLCC packages. The fundamental understanding gained from this study can be extrapolated to similar structures, enabling manufacturers to implement effective strategies for crack reduction across a wider range of MLCC applications.

The moisture-induced crack propagation in the soft-termination MLCC during thermal reflow process has not been reported to date. X-FEM numerical analysis on crack propagation have never been researched on the soft-termination MLCC.

This study aims to discuss the state-of-the-art digital factory (DF) development combining digital twins (DTs), sensing devices, laser additive manufacturing (LAM) and subtractive manufacturing (SM) processes. The current shortcomings and outlook of the DF also have been highlighted. A DF is a state-of-the-art manufacturing facility that uses innovative technologies, including automation, artificial intelligence (AI), the Internet of Things, additive manufacturing (AM), SM, hybrid manufacturing (HM), sensors for real-time feedback and control, and a DT, to streamline and improve manufacturing operations.

This study presents a novel perspective on DF development using laser-based AM, SM, sensors and DTs. Recent developments in laser-based AM, SM, sensors and DTs have been compiled. This study has been developed using systematic reviews and meta-analyses (PRISMA) guidelines, discussing literature on the DTs for laser-based AM, particularly laser powder bed fusion and direct energy deposition, in-situ monitoring and control equipment, SM and HM. The principal goal of this study is to highlight the aspects of DF and its development using existing techniques.

A comprehensive literature review finds a substantial lack of complete techniques that incorporate cyber-physical systems, advanced data analytics, AI, standardized interoperability, human–machine cooperation and scalable adaptability. The suggested DF effectively fills this void by integrating cyber-physical system components, including DT, AM, SM and sensors into the manufacturing process. Using sophisticated data analytics and AI algorithms, the DF facilitates real-time data analysis, predictive maintenance, quality control and optimal resource allocation. In addition, the suggested DF ensures interoperability between diverse devices and systems by emphasizing standardized communication protocols and interfaces. The modular and adaptable architecture of the DF enables scalability and adaptation, allowing for rapid reaction to market conditions.

Based on the need of DF, this review presents a comprehensive approach to DF development using DTs, sensing devices, LAM and SM processes and provides current progress in this domain.

The purpose of this study is to propose a precise and standardized strategy for numerically simulating vehicle aerodynamics.

Error sources in computational fluid dynamics were analyzed. Additionally, controllable experiential and discretization errors, which significantly influence the calculated results, are expounded upon. Considering the airflow mechanism around a vehicle, the computational efficiency and accuracy of each solution strategy were compared and analyzed through numerous computational cases. Finally, the most suitable numerical strategy, including the turbulence model, simplified vehicle model, calculation domain, boundary conditions, grids and discretization scheme, was identified. Two simplified vehicle models were introduced, and relevant wind tunnel tests were performed to validate the selected strategy.

Errors in vehicle computational aerodynamics mainly stem from the unreasonable simplification of the vehicle model, calculation domain, definite solution conditions, grid strategy and discretization schemes. Using the proposed standardized numerical strategy, the simulated steady and transient aerodynamic characteristics agreed well with the experimental results.

Building upon the modified Low-Reynolds Number k-e model and Scale Adaptive Simulation model, to the best of the authors’ knowledge, a precise and standardized numerical simulation strategy for vehicle aerodynamics is proposed for the first time, which can be integrated into vehicle research and design.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

This study aims to propose an aerodynamic force decomposition which, for the first time, allows for thrust/drag bookkeeping in two-dimensional viscous and unsteady flows. Lamb vector-based far-field methods are used at the scope, and the paper starts with extending recent steady compressible formulas to the unsteady regime.

Exact vortical force formulas are derived considering inertial or non-inertial frames, viscous or inviscid flows, fixed or moving bodies. Numerical applications to a NACA0012 airfoil oscillating in pure plunging motion are illustrated, considering subsonic and transonic flow regimes. The total force accuracy and sensitivity to the control volume size is first analysed, then the axial force is decomposed and results are compared to the inviscid force (thrust) and to the steady force (drag).

Two total axial force decompositions in thrust and drag contributions are proposed, providing satisfactory results. An additional force decomposition is also formulated, which is independent of the arbitrary pole appearing in vortical formulas. Numerical inaccuracies encountered in inertial reference frames are eliminated, and the extended formulation also allows obtaining an accurate force prediction in presence of shock waves.

No thrust/drag bookkeeping methodology was actually available for oscillating airfoils in viscous and compressible flows.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.