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The purpose of this study is to assess a novel method for creating tangible three-dimensional (3D) morphologies (scaled models) of neuronal reconstructions and to evaluate its cost-effectiveness, accessibility and applicability through a classroom survey. The study addresses the challenge of accurately representing intricate and diverse dendritic structures of neurons in scaled models for educational purposes.

The method involves converting neuronal reconstructions from the NeuromorphoVis repository into 3D-printable mold files. An operator prints these molds using a consumer-grade desktop 3D printer with water-soluble polyvinyl alcohol filament. The molds are then filled with casting materials like polyurethane or silicone rubber, before the mold is dissolved. We tested our method on various neuron morphologies, assessing the method’s effectiveness, labor, processing times and costs. Additionally, university biology students compared our 3D-printed neuron models with commercially produced counterparts through a survey, evaluating them based on their direct experience with both models.

An operator can produce a neuron morphology’s initial 3D replica in about an hour of labor, excluding a one- to three-day curing period, while subsequent copies require around 30 min each. Our method provides an affordable approach to crafting tangible 3D neuron representations, presenting a viable alternative to direct 3D printing with varied material options ensuring both flexibility and durability. The created models accurately replicate the fidelity and intricacy of original computer aided design (CAD) files, making them ideal for tactile use in neuroscience education.

The development of data processing and cost-effective casting method for this application is novel. Compared to a previous study, this method leverages lower-cost fused filament fabrication 3D printing to create accurate physical 3D representations of neurons. By using readily available materials and a consumer-grade 3D printer, the research addresses the high cost associated with alternative direct 3D printing techniques to produce such intricate and robust models. Furthermore, the paper demonstrates the practicality of these 3D neuron models for educational purposes, making a valuable contribution to the field of neuroscience education.

Purpose – This study aims to determine the roles of technology trough digital democracy in younger generation’s political education.

Design/Methodology/Approach – The language is analyzed using the theory of generative morphology which is developed by Morris Hale, Aronoff, Scalise, and Dardjowidjojo. The basic theory is the word formation through affixation process.

Findings – It is found that Devayan belongs to agglitunative-type language. Therefore, this language forms its words using prefixes, infixes, and suffixes by managing the process of morphemes compounding in order to get actual and potential words. Potential word formation is classified as language units that do not exist in reality.

Research Limitations/Implications – This research limits the scope of attention only on the morphological process.

Originality/Value – The findings can be used as references for those concerns in the revitalization of this minority language in the effort of composing a dictionary of Devayan.

This paper is devoted to prepare micro-cone structure with variable cross-section size by Stereo Lithography Appearance (SLA)-based 3D additive manufacturing technology. It is mainly focused on analyzing the forming mechanism of equipment and factors affecting the forming quality and accuracy, investigating the influence of forming process parameters on the printing quality and optimization of the printing quality. This study is expected to provide a µ-SLA surface preparation technology and process parameters selection with low cost, high precision and short preparation period for microstructure forming.

The µ-SLA process is optimized based on the variable cross-section micro-cone structure printing. Multi-index analysis method was used to analyze the influence of process parameters. The process parameter influencing order is determined and validated with flawless micro array structure.

After the optimization analysis of the top diameter size, the bottom diameter size and the overall height, the influence order of the printing process parameters on the quality of the micro-cone forming is: exposure time (B), print layer thickness (A) and number of vibrations (C). The optimal scheme is A1B3C1, that is, the layer thickness of 5 µm, the exposure time of 3000 ms and the vibration of 64x. At this time, the cone structure with the bottom diameter of 50 µm and the cone angle of 5° could obtain a better surface structure.

This study is expected to provide a µ-SLA surface preparation technology and process parameters selection with low cost, high precision and short preparation period for microstructure forming.

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu₃Sn layer which locate between the intermetallic Cu₆Sn₅ and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu₃Sn and Cu₆Sn₅ do affected seriously by heat, but Ni₃Sn₄ is not affected by heat or moisture.

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

The Cu₆Sn₅ intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu₃Sn IMC. Cu₆Sn₅ IMC will convert to Cu₃Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu₃Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni₃Sn₄ IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni₃Sn₄ IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.