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Electronic components’ efficiency is the cornerstone of technology progress. The cooling process used for electronic components plays a main role in their performance. Embedded high-conductivity material and provided microchannel heat sink are two common cooling methods. The former is expensive to implement while the latter needs micro-pump, which consumes energy to circulate the flow. The aim of this study is providing a new configuration and method for improving the performance of electronic components.

To manage these challenges and improve the cooling efficiency, a novel method named Hybrid is presented here. Each method's performance has been investigated, and the results are widely compared with others. Considering the micro-pump power, the supply of the microchannel flow and the thermal conductivity ratio (thermal conductivity ratio is defined as the ratio of thermal conductivity of high thermal conductivity material to the thermal conductivity of base solid), the maximum disk temperature of each method was evaluated and compared to others.

The results indicated that the Hybrid method can reduce the maximum disk temperature up to 90 per cent compared to the embedded high thermal conductivity at the same thermal conductivity ratio. Moreover, the Hybrid method further reduces the maximum disk temperature up to 75 per cent compared to the microchannel, at equivalent power consumption.

The information in this research is presented in such a way that designers can choose the desired composition, the limited amount of consumed energy and the high temperature of the component. According to the study of radial-hybrid configuration, the different ratio of microchannel and materials with a high thermal conductivity coefficient in the constant cooling volume was investigated. The goal of the investigation was to decrease the maximum temperature of a plate on constant energy consumption. This aim has been obtained in the radial-hybrid configuration.

The purpose of this study is to study the simultaneous effect of embedded reverting microchannels on the cooling performance and mechanical strength of the electronic pieces.

In this study, a new configuration of the microchannel heat sink was proposed based on the constructal theory to examine mechanical and thermal aspects. Initially, the thermal-mechanical behavior in the radial arrangement was analyzed, and then, by designing the first reverting channel, maximum temperature and maximum stress on the disk were decreased. After that, by creating second reverting channels, it has been shown that the piece is improved in terms of heat and mechanical strength.

Having placed the second reverting channel on the optimum location, the effect of creating the third reverting channel has been investigated. The study has shown that there is a close relationship between the maximum temperature and maximum stress in the disk as maximum temperature and maximum stress decrease in pieces with more uniform distribution channels.

The proposed structure has decreased the maximum temperature and maximum thermal stresses close to 35 and 50%, respectively, and also improved the mechanical strength, with and without thermal stresses, about 40 and 24%, respectively.