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The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

The objective of this article is to analyze the mediating role of innovation capability—both radical and incremental—between technological turbulence and digital innovation ecosystem performance, considering the impact of cross-organizational knowledge sabotage. Despite the enthusiasm surrounding digitization, the high failure rate (80%) of digital transformation projects has received limited attention. This alarming statistic indicates a potential rise in opportunistic behaviors within organizations. We hypothesize that employees seeking to reduce the risk of being displaced by digital technologies, may not only hide knowledge, as previously observed, but also engage in knowledge sabotage by disseminating inaccurate information during the co-creation of digital innovations within the digital innovation ecosystem.

The study employed structural equation modeling to examine moderated mediation using survey data collected from 148 firms, mainly from sectors of high to medium levels of digital intensity.

The most significant finding indicates that cross-organizational knowledge sabotage considerably reduces the only mediating effect, namely that of incremental innovation capability.

Our study presents a novel perspective by investigating the phenomenon of cross-organizational knowledge sabotage. Unlike prior research, which primarily identified the existence of knowledge hiding, our findings suggest that employees are not only willing to withhold information but also to disseminate inaccurate information to external partners. Consequently, our research extends the boundaries of the existing knowledge field by demonstrating that cross-organizational knowledge sabotage has repercussions that extend beyond intra-organizational impacts, as previously recognized. It also adversely affects the outcomes of collaborative work within the digital innovation ecosystem.

This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint.

Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO₂) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO₂, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven.

Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance R_thj-a of MOSFETs depends on TiO₂ concentration in the composite solder joint reaching the minimum R_thj at 0.25 Wt.% of TiO₂.

Mechanical strength: TiO₂ reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO₂ concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO₂ does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly.

Incorporating TiO₂ enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO₂ composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength.

The integration of TiO₂ reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO₂ concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry.

The research shows the importance of the soldering technology used to assemble MOSFET devices.

This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.

Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.

The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.

This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.

The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

The relevance of this research is determined by the fact that the creation of innovative goods and services involves a set of marketing activities to assess the market situation. Intellectual leadership becomes the basis of strategic foresight. Understanding the horizon of opportunities for an industrial enterprise reflects the trends in the evolutionary development of industry markets and their respective competencies. The formation of key competencies contributes to the elimination of marketing myopia. In this regard, the authors identified changes in the main trends in consumer demand. The research aims to build a client-centric business model in the B2B market. The empirical basis of this research is the statistical data “Indicators of innovative activity: 2022” and the works of S. Yu. Glazyev, N. Nonaka, H. Takeuchi, K. Freeman, and F. Jansen. Based on the method of logical-structural analysis, the authors reveal the essence of the content of the category “innovative development of industry,” give a rationale for the main directions of innovative transformations of the industry based on the implementation of a competency-based approach in management, and determine the patterns of innovative development of industry in the context of building technological sovereignty. The practical significance of this research lies in the fact that strategic business thinking will create a condition for the formation of new functionality (a new product concept), which requires the development of new key competencies and the implementation of a strategy for advanced development.

The research aims to assess the Russian automobile market before and after the imposition of sanctions, analyze the positions of Chinese automobile brands in the Russian market, and assess trends and prospects for the development of China's presence in this segment. The authors use the statistical method and the method of comparative analysis to determine the position of Chinese automakers in the Russian automotive market. The research determines that most Western and Japanese brands left the Russian market due to the strengthening of sanctions in 2022. Due to problems in the supply of components and spare parts, most of the Russian automotive market was filled with Chinese automobile companies planning to expand their presence. This research examines the trend of the presence of Chinese automobile brands in the automotive industry of Russia. Under sanctions, the economy of the Russian Federation is forced to look for other opportunities to develop technology and production. The relevance of this topic is due to the significant role of the automotive industry in the economy of any country, as well as the importance of this industry for the employment of the able-bodied population. To achieve this goal, the authors formulated the tasks to assess the automotive market before and after the imposition of sanctions, to analyze the Chinese automotive market, and to assess the prospects for its development in Russia.

Unlike well-documented market or behavioral uncertainty, patent uncertainty has been significantly under-explored in the field of international entrepreneurship. Drawing on an institution-based view of strategy, this study investigated Netac, a Chinese knowledge-based international new venture (KINV), which was facing uncertainty over patents in China and the US. The aim was to address two questions: (1) how does patent uncertainty emerge in the context of KINVs? And (2) how can KINVs navigate patent hazards by interacting with national patent institutions?

A longitudinal single-case study approach was adopted as the most appropriate method for exploring novel business phenomena and dynamic processes.

Results suggested that a KINV can adopt strategies to build a unique identity and so better conform to the expectations of institutions that ultimately decide on patent validity. Strategies may involve building institutional awareness, amplifying mass media effects, and strategically managing the intellectual property and socio-emotional tensions between China and the US.

This study introduced the notion of patent uncertainty into research around international new ventures, highlighting how this type of uncertainty in the advanced technology sector can affect the end-product and patent licensing opportunities of KINVs. It also explored the institution-based view of company strategy in the internationalization process by emphasizing interactive institutional mechanisms, and the role of an organization’s identity when interacting with institutions. The study enriches the literature on institutional theory and organizational identity, and also suggests solutions for firms dealing with efforts by competitors to invalidate patents.

The purpose of this research is to study the performance of piezoresistive pressure sensors using polysilicon as the piezoresistive material, which is typically used to measure pressure in high-temperature environments.

The performance of this sensor is enhanced by studying the influence of multi-turn configuration at which the piezoresistors are arranged. Different configurations are studied and compared by laying down their analytical solution.

The validation of analytical results is accomplished through finite element analysis using the software COMSOL Multiphysics. The best configuration, which uses a partial triple-turn configuration, was able to achieve a sensitivity of 116.00 mV/V/MPa over a simulated pressure range of 0 to 500 KPa.

The literature shows the study of single-turn and double-turn meander-shaped configuration of micro-electromechanical systems piezoresistive pressure sensor but multi-turn meander-shaped configuration using a square silicon diaphragm has not been reported. Its study has reflected promising results than its counterparts based on key performance parameters such as sensitivity and linearity and are more effective to be used for automotive, aviation, biomedical and consumer electronics applications.

This qualitative investigation is one of a series of sub-investigations under an umbrella project to develop Lampang Creative Livable Tourist City. The aim of this paper is to explore the integration of sustainable tourism into the development of Lampang, a city in northern Thailand. By collaborating with government and private agencies, academics, community leaders and the people of Lampang to reskill and upskill core community groups in the city, the researchers hope to enhance active citizenship, develop relevant skills and foster leadership networks that boost Lampang’s appeal as a sustainable tourism destination.

Data were gathered from brainstorming meetings, focus group discussions, observations and in-depth interviews. After identifying key characteristics required for creative citizens of Lampang city, the researchers developed and implemented pilot curricula with five target groups. Activities were developed to nurture creative leaders and promote innovative use of traditional culture and lifestyle.

The findings revealed that targeted local curricula can harness the cultural capital of the local community and equip locals with a modern toolkit to lay the foundations for a creative, livable tourist city.

This study’s originality lies in its grassroots approach to defining creative citizenship. It captures local community perspectives on what constitutes a creative citizen. Moreover, this research demonstrates how custom-designed educational initiatives can effectively nurture a creative and resilient urban ecosystem. This offers a blueprint for culturally informed urban regeneration, highlighting the role of sustainable tourism in enhancing the city’s attractiveness and livability for both residents and visitors.