Search results

The study of relevant geometrical parameters for the design and fabrication of thick film microchannels has been considered in this work. An analysis of geometrical behaviour was performed applying linear regression techniques. This procedure allows the design of structural elements (lateral walls) necessary for channels, predicting the final dimensions for original screen pattern design. A 100 μm wide and 15 μm high microchannel was constructed on the basis of the characteristics defined in the study.

The development of new, inexpensive, robust and miniaturised sensors is continuously being sought and it is believed that thick‐film technology can help to achieve these goals. A strain sensor utilising the piezoresistive properties of thick‐film resistors is described here. Characterisation of the sensing element has revealed that the gauge factor is significantly higher than that of metal foil strain gauges and the temperature coefficients are generally lower than those found for semiconductor strain gauges. Results show how the gauge factor can be optimised by varying the production parameters.