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Article
Publication date: 28 June 2011

John Ling

318

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Soldering & Surface Mount Technology, vol. 23 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2004

John Ling

212

Abstract

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Microelectronics International, vol. 21 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 June 2004

John Ling

199

Abstract

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Circuit World, vol. 30 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 2004

John Ling

212

Abstract

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Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

Content available
167

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Soldering & Surface Mount Technology, vol. 18 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 July 2005

Richard Heaney

This paper analyses the value to a poorly diversified risk‐averse executive of a compensation package consisting of a risk free asset, restricted stock and stock options. The…

1654

Abstract

This paper analyses the value to a poorly diversified risk‐averse executive of a compensation package consisting of a risk free asset, restricted stock and stock options. The Lambert, Larcker and Verrecchia (1991) model is extended to include leverage and this facilitates comparison of cost to the firm and benefits to the executive of restricted stock and stock options. It also provides insight into the impact of executive risk aversion, firm leverage and underlying as set volatility on the value of a compensation package in the hands of the executive.

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Managerial Finance, vol. 31 no. 7
Type: Research Article
ISSN: 0307-4358

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Content available
Article
Publication date: 1 August 2004

John Ling

46

Abstract

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Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 1 December 2003

John Ling

333

Abstract

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Circuit World, vol. 29 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 2005

John Ling

51

Abstract

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Circuit World, vol. 31 no. 1
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 1 January 2006

John Ling

176

Abstract

Details

Microelectronics International, vol. 23 no. 1
Type: Research Article
ISSN: 1356-5362

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1 – 10 of over 3000