Search results

1 – 10 of 12
Content available
Article
Publication date: 1 August 2004

62

Abstract

Details

Industrial Robot: An International Journal, vol. 31 no. 4
Type: Research Article
ISSN: 0143-991X

Keywords

Article
Publication date: 1 December 1996

P. Swanson

Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturingindustry with increasing frequency because their properties and process…

87

Abstract

Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturing industry with increasing frequency because their properties and process advantages are a good fit for the manufacturing requirements which are demanded by current industry drivers, such as miniaturisation, environmental and health & safety demands, manufacturing yield improvement and total product cost. Light curing adhesive systems in the electronics manufacturing industry have found applications in strain relief, wire and parts tacking, coil terminating, tamper‐proofing, structural bonding, temporary masking, potting, encapsulation, glob topping, conformal coating, and surface mount component attachment. This paper describes three case histories where photo cure adhesives were introduced to an electronics manufacturing environment, and discusses their rationale, implementation and their economics. The case histories encompass printed circuit board assembly (including surface mount), electronics packaging and microelectronic encapsulation. Production managers and process engineers are given confidence that practical adhesive application can be clean, fast and economical.

Details

Soldering & Surface Mount Technology, vol. 8 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2002

66

Abstract

Details

Assembly Automation, vol. 22 no. 4
Type: Research Article
ISSN: 0144-5154

Keywords

Content available
Article
Publication date: 25 September 2007

44

Abstract

Details

Soldering & Surface Mount Technology, vol. 19 no. 4
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 6 April 2012

405

Abstract

Details

Assembly Automation, vol. 32 no. 2
Type: Research Article
ISSN: 0144-5154

Article
Publication date: 1 February 1990

Alpha Metals will be showing their extensive range of high quality solders, solder pastes and solder related chemicals in working production equipment in association with…

Abstract

Alpha Metals will be showing their extensive range of high quality solders, solder pastes and solder related chemicals in working production equipment in association with Electrovert. Demonstrated for the first time at any exhibition will be the new Alpha Fine Line Paste, a new generation of solder paste specifically designed for close pitch SMT assembly.

Details

Circuit World, vol. 16 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 March 1995

K. Griesfeller

Quad Europe Ltd has announced the appointment of two Regional Sales Managers in the UK, Ashley Dakin and Ross Fraser who become responsible for sales of ‘Quadline’ in the South…

Abstract

Quad Europe Ltd has announced the appointment of two Regional Sales Managers in the UK, Ashley Dakin and Ross Fraser who become responsible for sales of ‘Quadline’ in the South and North of the UK respectively. Ashley joins Quad Europe from Automation Ltd while Ross comes from TDK.

Details

Soldering & Surface Mount Technology, vol. 7 no. 3
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 March 1985

The Electroplating Products and Equipment Business Area of Degussa AG, Frankfurt am Main, Federal Republic of Germany, has begun to supply a new selective electroplating plant…

Abstract

The Electroplating Products and Equipment Business Area of Degussa AG, Frankfurt am Main, Federal Republic of Germany, has begun to supply a new selective electroplating plant. Under a co‐operation agreement with the Telmec company of Milan, Italy, this business area of Degussa, which is based in Schwäbisch Gmüd, Germany, has begun to market the Telmec SL 6 ‘Tab Plater’ throughout the world, with the exception of Italy and France. The equipment was developed specially for manufacturers of printed circuit boards, and is used for the continuous electroplating of strip contacts on these boards.

Details

Circuit World, vol. 11 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 April 1995

Orbotech SA, Brussels, has announced the appointment of Kevin Smith as Sales Executive for its UK office. Mr Smith joints Orbotech with several years' experience in the…

Abstract

Orbotech SA, Brussels, has announced the appointment of Kevin Smith as Sales Executive for its UK office. Mr Smith joints Orbotech with several years' experience in the disciplines of CAD systems and networks and photoplotting. He will be based in the company's Rochdale office and will work with Rob Sawyer, UK Regional Manager, in selling Orbotech's AOI, CAM and Plotter products throughout the United Kingdom.

Details

Circuit World, vol. 21 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 February 1986

When the new Internepcon Production Show and Conference opens its doors on 8th April 1986, at the NEC Birmingham, it will be the UK's first event to concentrate its product…

Abstract

When the new Internepcon Production Show and Conference opens its doors on 8th April 1986, at the NEC Birmingham, it will be the UK's first event to concentrate its product profile and conference sessions on electronics production line technology. To ensure that this exciting show is of even greater benefit to the visitors, the emphasis will be on production line technology in action, with many of the products actually operating on the stands.

Details

Circuit World, vol. 12 no. 3
Type: Research Article
ISSN: 0305-6120

1 – 10 of 12