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Article
Publication date: 18 March 2024

Min Zeng, Jianxing Xie, Zhitao Li, Qincheng Wei and Hui Yang

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter…

Abstract

Purpose

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Design/methodology/approach

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

Findings

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

Originality/value

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 30 April 2024

Ignacio Jesús Álvarez Gariburo, Hector Sarnago and Oscar Lucia

Plasma technology has become of great interest in a wide variety of industrial and domestic applications. Moreover, the application of plasma in the domestic field has increased…

Abstract

Purpose

Plasma technology has become of great interest in a wide variety of industrial and domestic applications. Moreover, the application of plasma in the domestic field has increased in recent years due to its applications to surface treatment and disinfection. In this context, there is a significant need for versatile power generators able to generate a wide range of output voltage/current ranging from direct current (DC) to tens of kHz in the range of kVs. The purpose of this paper is to develop a highly versatile power converter for plasma generation based on a multilevel topology.

Design/methodology/approach

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The followed methodology includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and test laboratory tests after building an eight-level prototype.

Findings

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 10 kVpp output voltage and 10 kHz, proving the feasibility of the proposed approach.

Originality/value

The proposed converter enables versatile waveform generation, enabling advanced studies in plasma generation. Unlike previous proposals, the proposed converter features bidirectional operation, allowing to test complex reactive loads. Besides, complex waveforms can be generated, allowing testing complex patterns for optimized cold-plasma generation methods. Besides, unlike transformer- or resonant-network-based approaches, the proposed generator features very low output impedance regardless the operating point, exhibiting improved and reliable performance for different operating conditions.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering , vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 15 April 2024

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Zuraihana Bachok, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohamad Riduwan Ramli and Muhamed Abdul Fatah bin Muhamed Mukhtar

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Abstract

Purpose

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Design/methodology/approach

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Findings

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

Practical implications

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Originality/value

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 20 December 2023

Indira Damarla, Venmathi M., Krishnakumar V. and Anbarasan P.

In this paper, a new front end converter (FEC) topology has been proposed for the switched reluctance (SR) motor drive. This study aims to present the performance analysis of…

Abstract

Purpose

In this paper, a new front end converter (FEC) topology has been proposed for the switched reluctance (SR) motor drive. This study aims to present the performance analysis of FEC-based SR motor drive using various types of control schemes like conventional proportional integral (PI) controller, fuzzy logic controller (FLC) and fuzzy-tuned proportional integral controller (Fuzzy-PI).

Design/methodology/approach

The proposed FEC-based SR motor drive with various control strategies is derived for the torque ripple minimization and speed control.

Findings

The steady state and the dynamic response of the FEC-based SR motor drive are analyzed using three different controllers under change in speed and loading conditions. The Fuzzy-PI-based control scheme improves the dynamic response of the system when compared with the FLC and the conventional PI controller.

Originality/value

The hardware prototype has been implemented for the FEC-based SR motor drive by using the Xilinx SPARTAN 6 FPGA processor. The experimental verification has been conducted and the results have been measured under steady state and dynamic conditions.

Details

Circuit World, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0305-6120

Keywords

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