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Article
Publication date: 1 December 2004

42

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Sensor Review, vol. 24 no. 4
Type: Research Article
ISSN: 0260-2288

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Microelectronics International, vol. 23 no. 2
Type: Research Article
ISSN: 1356-5362

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164

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Microelectronics International, vol. 16 no. 2
Type: Research Article
ISSN: 1356-5362

Open Access
Article
Publication date: 26 July 2021

Weifei Hu, Tongzhou Zhang, Xiaoyu Deng, Zhenyu Liu and Jianrong Tan

Digital twin (DT) is an emerging technology that enables sophisticated interaction between physical objects and their virtual replicas. Although DT has recently gained significant…

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Abstract

Digital twin (DT) is an emerging technology that enables sophisticated interaction between physical objects and their virtual replicas. Although DT has recently gained significant attraction in both industry and academia, there is no systematic understanding of DT from its development history to its different concepts and applications in disparate disciplines. The majority of DT literature focuses on the conceptual development of DT frameworks for a specific implementation area. Hence, this paper provides a state-of-the-art review of DT history, different definitions and models, and six types of key enabling technologies. The review also provides a comprehensive survey of DT applications from two perspectives: (1) applications in four product-lifecycle phases, i.e. product design, manufacturing, operation and maintenance, and recycling and (2) applications in four categorized engineering fields, including aerospace engineering, tunneling and underground engineering, wind engineering and Internet of things (IoT) applications. DT frameworks, characteristic components, key technologies and specific applications are extracted for each DT category in this paper. A comprehensive survey of the DT references reveals the following findings: (1) The majority of existing DT models only involve one-way data transfer from physical entities to virtual models and (2) There is a lack of consideration of the environmental coupling, which results in the inaccurate representation of the virtual components in existing DT models. Thus, this paper highlights the role of environmental factor in DT enabling technologies and in categorized engineering applications. In addition, the review discusses the key challenges and provides future work for constructing DTs of complex engineering systems.

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Journal of Intelligent Manufacturing and Special Equipment, vol. 2 no. 1
Type: Research Article
ISSN: 2633-6596

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126

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Microelectronics International, vol. 27 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 24 April 2007

John Ling

677

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Microelectronics International, vol. 24 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 14 September 2012

Martin Goosey

268

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Soldering & Surface Mount Technology, vol. 24 no. 4
Type: Research Article
ISSN: 0954-0911

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Book part
Publication date: 16 January 2024

Ayodeji E. Oke and Seyi S. Stephen

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A Digital Path to Sustainable Infrastructure Management
Type: Book
ISBN: 978-1-83797-703-1

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Article
Publication date: 18 May 2010

J.H. Ling

52

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Circuit World, vol. 36 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 10 July 2007

72

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Aircraft Engineering and Aerospace Technology, vol. 79 no. 4
Type: Research Article
ISSN: 0002-2667

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