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This study aims to investigate the influence mechanism of brazing and aging on the strengthening and corrosion behavior of novel multilayer sheets (AA4045/AA7072/AA3003M/AA4045).

Polarization curve tests, immersion experiments and transmission electron microscopy analysis were used to study the corrosion behavior and tensile properties of the sheets before and after brazing and aging.

The strength of the sheet is weakened after brazing due to brittle eutectic phases, and recovered after aging due to enhanced precipitation strengthening in the AA7072 interlayer. The core of nonbrazed sheets cannot be protected due to the significant galvanic coupling effect between the intermetallic particles and the substrate. Brazing and aging treatments promote the redissolved of second phased and limit corrosion along the eutectic region in the clad, allowing the core to be protected.

AA7xxx alloy was added to conventional brazed sheets to form a novel Al alloy composite sheet with AA4xxx/AA7xxx/AA3xxx structure. The strengthening and corrosion mechanism of the sheet was proposed. The added interlayer can sacrificially protect the core from corrosion and improves strength after aging treatment.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

To solve the problems caused by using precise molds for copper column positioning in the current column grid array package, this paper aims to optimize the proposed friction plunge micro-welding (FPMW) technology without mold assistance, to overcome the problems of low interfacial bonding strength, shrinkage cavities and flash defects caused by the low hold-tight force of solder on the copper column.

A pressurizing device installed under the drill chuck of the friction welding machine is designed, which is used to apply a static constraint to the solder ball obliquely downward to increase the hold-tight force of the peripheral solder on the copper column during welding and promote the friction metallurgical connection between them.

The results show that the application of static constraint during welding can increase the compactness of the solder near the friction interface and effectively inhibit occurrences of flash, shrinkage cavities and crystal defects such as vacancies. Therefore, compared with the unconstrained (UC) FPMW, the average strength of the statically constrained (SC) FPMW joints and aged SC-FPMW joints can be increased by 51.1% and 122.6%, and the problem of the excessive growth of the interfacial connection layer in the UC-FPMW joints during aging can be effectively avoided.

The application of static constraint effectively inhibits the occurrence of defects such as shrinkage cavities, vacancies and flash in FPMW joints, and the welding quality is significantly improved.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

This study has assessed the thermal performance of locally fabricated bio-based building envelopes made of coconut and corn husk composite bricks to reduce building wall heat transmission load and energy consumption towards green building adaptation.

Samples of coconut fiber (coir) and corn husk fiber bricks were fabricated and tested for their thermophysical properties using the Transient Plane Source (TPS) 2500s instrument. A simulation was conducted using Dynamic Energy Response of Building - Lunds Tekniska Hogskola (DEROB-LTH) to determine indoor temperature variation over 24 h. The time lag and decrement factor, two important parameters in evaluating building envelopes, were also determined.

The time lag of the bio-based composite building envelope was found to be in the range of 4.2–4.6 h for 100 mm thickness block and 10.64–11.5 h for 200 mm thickness block. The decrement factor was also determined to be in the range of 0.87–0.88. The bio-based composite building envelopes were able to maintain the indoor temperature of the model from 25.4 to 27.4 °C, providing a closely stable indoor thermal comfort despite varying outdoor temperatures. The temperature variation in 24 h, was very stable for about 8 h before a degree increment, providing a comfortable indoor temperature for occupants and the need not to rely on air conditions and other mechanical forms of cooling. Potential energy savings also peaked at 529.14 kWh per year.

The findings of this study present opportunities to building developers and engineers in terms of selecting vernacular materials for building envelopes towards green building adaptation, energy savings, reduced construction costs and job creation.

This study presents for the first time, time lag and decrement factor for bio-based composite building envelopes for green building adaptation in hot climates, as found in Ghana.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

The purpose of this study is to develop a protective coating system on mild steel panel incorporating epoxidized natural rubber with acrylic polyol resin.

In this work, a novel attempt is made to develop binder coatings using epoxidized natural rubber-based material and an organic resin (acrylic resin) for corrosion protection on metal substrate. Seven different samples of multifunctional coatings are developed by varying the compositions of epoxidized natural rubber (ENR) and acrylic resin. The properties of the developed coatings have been characterized using analytical methods such as Fourier transform infrared spectroscopy (FTIR) and electrochemical impedance spectroscopy (EIS). EIS has been carried out for 30 days to evaluate the corrosion resistance after immersing into 3.5 wt.% of sodium chloride. Cross hatch cut tester (CHT) has been used to study the adhesive properties. UV–Visible Spectroscopy (UV–Vis) was also used to assess changes in the coating-film transparency of the natural rubber-based coating systems in this study.

The developed coatings have formed uniform layer on the substrate. CHT results show excellent adhesion of the coatings. Higher concentrations of ENR have higher transparency level, which reduces when the acrylic concentration increases. FTIR analysis confirms the crosslinking that occurred between the components of the coatings. Based on the impedance data from EIS, the incorporation of natural rubber can be an additive for the corrosion protection, which has the coating resistance values well above 108Ω even after 30 days of immersion.

The blending method provides a simple and practical solution to improve the strength and adhesion properties of acrylic polyol resin with epoxidized natural rubber. There is still improvement needed for long-term applications.

The work has been conducted in our laboratory. The combination of natural rubber-based materials and organic resins is a new approach in coating research.