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This paper aims to study the possibility of electroplating copper coatings on chemically and chemical-galvanically nickel-plated acrylic fibers, to be further processed into yarn, fabrics, knitwear and nonwoven materials.

Electrically conductive fibers with different copper contents have been obtained, and the effect of electrolyte pH, its composition, current strength at the first and second cathodes, as well as the metallization time on the electrophysical, physical and mechanical properties of copper-containing fibers, has been studied.

The studies have shown that with an increase in the copper content, the electrical conductivity, the uniformity of the coating and the uniformity of the electrophysical properties (for chemical-galvanically nickel-plated fiber) increase. In the case of copper plating of chemically nickel-plated fiber, the coefficient of variation in electrical resistance increases with increasing plating time, even though the copper content increases, and the coefficient of variation in copper content and electrical resistance decreases. The physical and mechanical properties of copper-containing fibers differ slightly from the original (subjected to copper plating) and industrial Nitron fibers. With copper plating, the strength of the fiber practically does not decrease, and the elongation decreases somewhat, compared with the mass-produced Nitron fiber.

The physical and mechanical properties of copper-containing fibers are quite high, which makes it possible to be successfully further processed into yarn, fabrics, knitwear and nonwoven materials.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

The purpose of this study is to investigate the influence of varying concentrations of nano-SiO₂ particle doping on the structure and properties of the micro-arc oxidation (MAO) coating of 7075 aluminum alloy. This research aims to provide novel insights and methodologies for the surface treatment and protection of 7075 aluminum alloy.

The surface morphology of the MAO coating was characterized using scanning electron microscope. Energy spectrometer was used to characterize the elemental content and distribution on the surface and cross section of the MAO coating. The phase composition of the MAO coating was characterized using X-ray diffractometer. The corrosion resistance of the MAO coating was characterized using an electrochemical workstation.

The results showed that when the addition of nano-SiO₂ particles is 3 g/L, the corrosion resistance is optimal.

This study investigated the influence of different concentrations of nano-SiO₂ particles on the structure and properties of the MAO coating of 7075 aluminum alloy.

The purpose of this paper is to assess the hydrogen embrittlement sensitivity of carbon gradient heterostructure materials and to verify the reliability of the scratch method.

The surface-modified layer of 18CrNiMo7-6 alloy steel was delaminated to study its hydrogen embrittlement characteristics via hydrogen permeation, electrochemical hydrogen charging and scratch experiments.

The results showed that the diffusion coefficients of hydrogen in the surface and matrix layers are 3.28 × 10⁻⁷ and 16.67 × 10⁻⁷ cm²/s, respectively. The diffusible-hydrogen concentration of the material increases with increasing hydrogen-charging current density. For a given hydrogen-charging current density, the diffusible-hydrogen concentration gradually decreases with increasing depth in the surface-modified layer. Fracture toughness decreases with increasing diffusible-hydrogen concentration, so the susceptibility to hydrogen embrittlement decreases with increasing depth in the surface-modified layer.

The reliability of the scratch method in evaluating the fracture toughness of the surface-modified layer material is verified. An empirical formula is given for fracture toughness as a function of diffused-hydrogen concentration.

Aluminum alloy is considered an ideal material in aerospace, automobile and other fields because of its lightweight, high specific strength and easy processing. However, low hardness and strength of the surface of aluminum alloys are the main factors that limit their applications. The purpose of this study is to obtain a composite coating with high hardness and lubricating properties by applying GO–PVA over MAO coating.

A pulsed bipolar power supply was used as power supply to prepare the micro-arc oxidation (MAO) coating on 6061 aluminum sample. Then a graphene oxide-polyvinyl alcohol (GO–PVA) composite coating was prepared on MAO coating for subsequent experiments. Samples were characterized by Fourier infrared spectroscopy, X-ray diffraction, Raman spectroscopy and thermogravimetric analysis. The friction test is carried out by the relative movement of the copper ball and the aluminum disk on the friction tester.

Results showed that the friction coefficient of MAO samples was reduced by 80% after treated with GO–PVA composite film.

This research has made a certain contribution to the surface hardness and tribological issues involved in the lightweight design of aluminum alloys.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-12-2023-0427/

The purpose of this review is to comprehensively consider the material properties and processing of additive titanium alloy and provide a new perspective for the robotic grinding and polishing of additive titanium alloy blades to ensure the surface integrity and machining accuracy of the blades.

At present, robot grinding and polishing are mainstream processing methods in blade automatic processing. This review systematically summarizes the processing characteristics and processing methods of additive manufacturing (AM) titanium alloy blades. On the one hand, the unique manufacturing process and thermal effect of AM have created the unique processing characteristics of additive titanium alloy blades. On the other hand, the robot grinding and polishing process needs to incorporate the material removal model into the traditional processing flow according to the processing characteristics of the additive titanium alloy.

Robot belt grinding can solve the processing problem of additive titanium alloy blades. The complex surface of the blade generates a robot grinding trajectory through trajectory planning. The trajectory planning of the robot profoundly affects the machining accuracy and surface quality of the blade. Subsequent research is needed to solve the problems of high machining accuracy of blade profiles, complex surface material removal models and uneven distribution of blade machining allowance. In the process parameters of the robot, the grinding parameters, trajectory planning and error compensation affect the surface quality of the blade through the material removal method, grinding force and grinding temperature. The machining accuracy of the blade surface is affected by robot vibration and stiffness.

This review systematically summarizes the processing characteristics and processing methods of aviation titanium alloy blades manufactured by AM. Combined with the material properties of additive titanium alloy, it provides a new idea for robot grinding and polishing of aviation titanium alloy blades manufactured by AM.

The novelty addressed here is undertaken by using tailor-made and fully characterized starch nanoparticles (SNPs) having a particle size ranging from 80 to 100 nm with a larger surface area, biodegradability and high reactivity as a starting substrate for cadmium ions and basic dye removal from wastewater effluent. This was done via carboxylation of SNPs with citric acid via esterification reaction using the dry preparation technique, in which a simple, energy-safe and sustainable process concerning a small amount of water, energy and toxic chemicals was used. The obtained adsorbent is designated as cross-linked esterified starch nanoparticles (CESNPs).

The batch technique was used to determine the CESNPs adsorption capacity, whereas atomic adsorption spectrometry was used to determine the residual cadmium ions concentration in the filtrate before and after adsorption. Different factors affecting adsorption were examined concerning pH, contact time, adsorbent dose and degree of carboxylation. Besides, to validate the esterification reaction and existence of carboxylic groups in the adsorbent, CESNPs were characterized metrologically via analytical tools for carboxyl content estimation and instrumental tools using Fourier-transform infrared spectroscopy (FTIR) spectra and scanning electron microscopy (SEM) morphological analysis.

The overall adsorption potential of CESNPs was found to be 136 mg/g when a 0.1 g adsorbent dose having 190.8 meq/100 g sample carboxyl content at pH 5 for 60 min contact time was used. Besides, increasing the degree of carboxylation of the CESNPs expressed as carboxyl content would lead to the higher adsorption capacity of cadmium ions. FTIR spectroscopy analysis elucidates the esterification reaction with the appearance of a new intense peak C=O ester at 1,700 cm⁻¹, whereas SEM observations reveal some atomic/molecules disorder after esterification.

The innovation addressed here is undertaken by studying the consequence of altering the extent of carboxylation reaction expressed as carboxyl contents on the prepared CESNPs via a simple dry technique with a small amount of water, energy and toxic chemicals that were used as a sustainable bio nano polymer for cadmium ions and basic dye removal from wastewater effluent in comparison with other counterparts published in the literature.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.