Search results

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

The purpose is to explore the free vibration behaviour of elastic foundation-supported porous functionally graded nanoplates using the Rayleigh-Ritz approach. The goal of this study is to gain a better knowledge of the dynamic response of nanoscale structures made of functionally graded materials and porous features. The Rayleigh-Ritz approach is used in this study to generate realistic mathematical models that take elastic foundation support into account. This research can contribute to the design and optimization of advanced nanomaterials with potential applications in engineering and technology by providing insights into the influence of material composition, porosity and foundation support on the vibrational properties of nanoplates.

A systematic methodology is proposed to evaluate the free vibration characteristics of elastic foundation-supported porous functionally graded nanoplates using the Rayleigh-Ritz approach. The study began by developing the mathematical model, adding material properties and establishing governing equations using the Rayleigh-Ritz approach. Numerical approaches to solve the problem are used, using finite element methods. The results are compared to current solutions or experimental data to validate the process. The results are also analysed, keeping the influence of factors on vibration characteristics in mind. The findings are summarized and avenues for future research are suggested, ensuring a robust investigation within the constraints.

The Rayleigh-Ritz technique is used to investigate the free vibration properties of elastic foundation-supported porous functionally graded nanoplates. The findings show that differences in material composition, porosity and foundation support have a significant impact on the vibrational behaviour of nanoplates. The Rayleigh-Ritz approach is good at modelling and predicting these properties. Furthermore, the study emphasizes the possibility of customizing nanoplate qualities to optimize certain vibrational responses, providing useful insights for engineering applications. These findings expand understanding of dynamic behaviours in nanoscale structures, making it easier to build innovative materials with specific features for a wide range of industrial applications.

The novel aspect of this research is the incorporation of elastic foundation support, porous structures and functionally graded materials into the setting of nanoplate free vibrations, utilizing the Rayleigh-Ritz technique. Few research have looked into this complex combo. By tackling complicated interactions, the research pushes boundaries, providing a unique insight into the dynamic behaviour of nanoscale objects. This novel approach allows for a better understanding of the interconnected effects of material composition, porosity and foundation support on free vibrations, paving the way for the development of tailored nanomaterials with specific vibrational properties for advanced engineering and technology applications.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

The purpose of this study is to design a wearable medical device as a human care platform and to introduce the design details, key technologies and practical implementation methods of the system.

A multi-channel data acquisition scheme based on PCI-E (rapid interconnection of peripheral components) was proposed. The flexible biosensor is integrated with the flexible data acquisition card with monitoring capability, and the embedded (device that can operate independently) chip STM32F103VET6 is used to realize the simultaneous processing of multi-channel human health parameters. The human health parameters were transferred to the upper computer LabVIEW by intelligent clothing through USB or wireless Bluetooth to complete the transmission and processing of clinical data, which facilitates the analysis of medical data.

The smart clothing provides a mobile medical cloud platform for wearable medical through cloud computing, which can continuously monitor the body's wrist movement, body temperature and perspiration for 24 h. The result shows that each channel is completely accurate to the top computer display, which can meet the expected requirements, and the wearable instant care system can be applied to healthcare.

The smart clothing in this study is based on the monitoring and diagnosis of textiles, and the electronic communication devices can cooperate and interact to form a wearable textile system that provides medical monitoring and prevention services to individuals in the fastest and most accurate way. Each channel of the system is precisely matched to the display screen of the host computer and meets the expected requirements. As a real-time human health protection platform technology, continuous monitoring of human vital signs can complete the application of human motion detection, medical health monitoring and human–computer interaction. Ultimately, such an intelligent garment will become an integral part of our everyday clothing.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

Solar cells could make textile-based wearable systems energy independent without the need for battery replacement or recharging; however, their laundry resistance, which is prerequisite for the product acceptance of e-textiles, has been rarely examined. This paper aims to report a systematic study of the laundry durability of solar cells embedded in textiles.

This research included small commercial monocrystalline silicon solar cells which were encapsulated with functional synthetic textile materials using an industrially relevant textile lamination process and found them to reliably endure laundry washing (ISO 6330:2012). The energy harvesting capability of eight textile laminated solar cells was measured after 10–50 cycles of laundry at 40 °C and compared with light transmittance spectroscopy and visual inspection.

Five of the eight textile solar cell samples fully maintained their efficiency over the 50 laundry cycles, whereas the other three showed a 20%–27% decrease. The cells did not cause any visual damage to the fabric. The result indicates that the textile encapsulated solar cell module provides sufficient protection for the solar cells against water, washing agents and mechanical stress to endure repetitive domestic laundry.

This study used rigid monocrystalline silicon solar cells. Flexible amorphous silicon cells were excluded because of low durability in preliminary tests. Other types of solar cells were not tested.

A review of literature reveals the tendency of researchers to avoid standardized textile washing resistance testing. This study removes the most critical obstacle of textile integrated solar energy harvesting, the washing resistance.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

This paper aims to explore the influence of corrosion-deformation interactions (CDI) on the corrosion behavior and mechanisms of 316LN under applied tensile stresses.

Corrosion of metals would be aggravated by CDI under applied stress. Notably, the presence of nitrogen in 316LN austenitic stainless steel (SS) would enhance the corrosion resistance compared to the nitrogen-absent 316L SS. To clarify the CDI behaviors, electrochemical corrosion experiments were performed on 316LN specimens under different applied stress levels. Complementary analyses, including three-dimensional morphological examinations by KH-7700 digital microscope and scanning electron microscopy coupled with energy dispersive spectroscopy, were conducted to investigate the macroscopic and microscopic corrosion morphology and to characterize the composition of corrosion products within pits. Furthermore, ion chromatography was used to analyze the solution composition variations after immersion corrosion tests of 316LN in a 6 wt.% FeCl₃ solution compared to original FeCl₃ solution. Electrochemical experiment results revealed the linear decrease in free corrosion potential with increasing applied stress. Electrochemical impedance spectroscopy results indicated that high tensile stress level damaged the integrity of passivation film, as evidenced by the remarkable reduction in electrochemical impedance. Ion chromatography analyses proved the concentrations increase of NO₃⁻ and NH₄⁺ ion concentrations in the corrosion media after corrosion tests.

The enhanced corrosion resistance of 316LN SS is attributable to the presence of nitrogen.

The scope of this study is confined to the influence of tensile stress on the electrochemical corrosion of 316LN at ambient temperatures; it does not encompass the potential effects of elevated temperatures or compressive stress.

The resistance to stress electrochemical corrosion in SS may be enhanced through nitrogen alloying.

This paper presents a systematic investigation into the stress electrochemical corrosion of 316LN, marking the inaugural study of its impact on corrosion behaviors and underlying mechanisms.

Devices for step estimation are body-worn devices used to compute steps taken and/or distance covered by the user. Even though textiles or clothing are foremost to come to mind in terms of articles meant to be worn, their prominence among devices and systems meant for cadence is overshadowed by electronic products such as accelerometers, wristbands and smart phones. Athletes and sports enthusiasts using knee sleeves should be able to track their performances and monitor workout progress without the need to carry other devices with no direct sport utility, such as wristbands and wearable accelerometers. The purpose of this study thus is to contribute to the broad area of wearable devices for cadence application by developing a cheap but effective and efficient stride measurement system based on a knee sleeve.

A textile strain sensor is designed by weft knitting silver-plated nylon yarn together with nylon DTY and covered elastic yarn using a 1 × 1 rib structure. The area occupied by the silver-plated yarn within the structure served as the strain sensor. It worked such that, upon being subjected to stress, the electrical resistance of the sensor increases and in turn, is restored when the stress is removed. The strip with the sensor is knitted separately and subsequently sewn to the knee sleeve. The knee sleeve is then connected to a custom-made signal acquisition and processing system. A volunteer was employed for a wearer trial.

Experimental results establish that the number of strides taken by the wearer can easily be correlated to the knee flexion and extension cycles of the wearer. The number of peaks computed by the signal acquisition and processing system is therefore counted to represent stride per minute. Therefore, the sensor is able to effectively count the number of strides taken by the user per minute. The coefficient of variation of over-ground test results yielded 0.03%, and stair climbing also obtained 0.14%, an indication of very high sensor repeatability.

The study was conducted using limited number of volunteers for the wearer trials.

By embedding textile piezoresistive sensors in some specific garments and or accessories, physical activity such as gait and its related data can be effectively measured.

To the best of our knowledge, this is the first application of piezoresistive sensing in the knee sleeve for stride estimation. Also, this study establishes that it is possible to attach (sew) already-knit textile strain sensors to apparel to effectuate smart functionality.