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As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This study aims to elucidate the machining properties of low-cost expanded clay-reinforced syntactic foams by using different neural network models for the first time in the literature. The main goal of this endeavor is to create a casting machining-neural network modeling flow-line for real-time foam manufacturing in the industry.

Samples were manufactured via an industry-based die-casting technology. For the slot milling tests performed with different cutting speeds, depth of cut and lubrication conditions, a 3-axis computer numerical control (CNC) machine was used and the force data were collected through a digital dynamometer. These signals were used as input parameters in neural network modelings.

Among the algorithms, the scaled-conjugated-gradient (SCG) methodology was the weakest average results, whereas the Levenberg–Marquard (LM) approach was highly successful in foreseeing the cutting forces. As for the input variables, an increase in the depth of cut entailed the cutting forces, and this circumstance was more obvious at the higher cutting speeds.

The effect of milling parameters on the cutting forces of low-cost clay-filled metallic syntactics was examined, and the correct detection of these impacts is considerably prominent in this paper. On the other side, tool life and wear analyses can be studied in future investigations.

It was indicated that the milling forces of the clay-added AA7075 syntactic foams, depending on the cutting parameters, can be anticipated through artificial neural network modeling.

It is hoped that analyzing the influence of the cutting parameters using neural network models on the slot milling forces of metallic syntactic foams (MSFs) will be notably useful for research and development (R&D) researchers and design engineers.

This work is the first investigation that focuses on the estimation of slot milling forces of the expanded clay-added AA7075 syntactic foams by using different artificial neural network modeling approaches.

This study aims to research the usage of virtual reality as a tool to train employees in a changeover process in a company, and if it guarantees the same level of quality. Moreover, another goal is to understand how it can influence the machines’ availability, reducing the number of hours a machine is stopped to perform training sessions.

To achieve the goals proposed, the action research strategy was used. After defining the context and purpose, two full cycles were applied, composed by five activities: diagnosis, action planning, action taking, action evaluation and specify the learning.

The results are extremely satisfactory. On the one hand, it can be concluded that virtual reality is a reliable training tool, guaranteeing proper training to the employees. On the other hand, based on the previous point, the researchers were able to conclude that it is possible to increase machines’ availability, reducing by 50% the time needed to have the machines stopped to run a changeover training.

To the authors’ knowledge, this is the first study to use the action research strategy to develop a virtual reality simulation as a training tool for machines’ changeover in the automotive industry.

This paper examines the framing of digital transformation. The research questions are specified as follows: what are the different types of framing strategies in response to digital transformation? How do the strategies differ across organizations? Theoretically, the authors draw on the framing perspective to emphasize the use of linguistic frames in shaping innovation and change processes. Empirically, the authors choose to study the Taiwanese sectors, including publicly governed entities, traditional private business or technology-based ventures.

The authors’ approach combines topic modeling and qualitative analysis. Using data collected from newspaper and magazine articles, the authors employ topic modeling to generate a set of distinctive framings that Taiwanese actors typically adopt to motivate and justify their digital move. The authors also conduct personal interviews to qualitatively complement the authors’ topic modeling analysis and to identify the rationale behind the linguistic framings and the strategic differences brought about by the various organizations.

The authors identify five topics that the Taiwanese actors commonly used in the framing of digital transformation. These topics or frames are labeled as cross-domain coordination, market demand, intelligent technology, global trend and competition and digital innovation. The practical use of the framings is contingent on organizational characteristics. Furthermore, the authors show how the framings can be classified as either positive framing (e.g. winning the next war) or negative framing (e.g. innovate or die), generally applicable to organizations around the world struggling to cope with digital disruption.

The authors’ study has two research implications. First, the authors extend the appreciation of the digital transformation from the usual concern with technological and business model innovations to linguistic or framing practices. Second, the authors enrich the framing analysis by emphasizing a practice or contingency perspective based on sector difference. The findings are subject to the limitations of the choice of only established and reputable media outlets, the diatextual reading and filtering of useful articles for topic modeling analysis and the use of world frequency to account for frame significance.

The authors shift actors' attention from improving technical efficiency to acquiring linguistic resources in the pursuit of digitalization. For example, framing the digital transformation in terms of creating a market orientation calls for not only real consumer power but also strategic discursive competence that enables the move to change. The findings also point out that practitioners can enlarge the scope of their agency rather than being trapped in the habituated routine of practices. Despite social embeddedness, organizations are more often widely connected and built enough to call for more of the cognitive frames to appeal to heterogeneous stakeholders.

The authors study contributes to the literature by developing a linguistic or socio-cognitive view of digital transformation strategy that is capable of expanding organizational attention toward change and innovation. The authors explore menus of strategic frames employed by actors in response to digital transformation. We also address the application of a machine-learning tool such as topic modeling to explore the socio-cognitive dimensions of digital transformation. Furthermore, the analysis leads us to identify the outcomes or effects – either positive or negative – that move beyond the particular Taiwanese case to explain the framing of digital transformation in general.

Bangladesh's ready-made garment (RMG) industry plays a vital role in the economic growth of this country. As the global trend in the fashion market has introduced a high-mix, low-volume ordering style, manufacturers are facing an increased number of changeovers in their production systems. However, most of the Bangladeshi RMG manufacturers are not yet ready to respond to such small orders and to improve the flexibility of their production systems. Consequently, the industry is falling behind in global market competition. Thus, this study aims to advance the current performance of RMG manufacturing operations to respond to the fast-fashion industry's challenges effectively using quick changeover.

In this study, a Single-Minute Exchange of Dies (SMED) is applied to attain quick changeover following the best practices of lean manufacturing.

This study examined the performance of the SMED technique to reduce changeover time in two case organisations. The changeover time was reduced by 70.76% from 434.56 min to 127.08 min and 42.12% from 2,664 min to 1,542 min for the case organisations, respectively. The results of this study show that companies require improved changeover times to address the demand for high-mix, low-volume orders.

This study will certainly guide practitioners of the RMG industry to adopt SMED to reduce changeover time to meet small batch production.

The purpose of this paper is to evaluate the effect of titanium oxide (TiO₂) and yttrium oxide (Y₂O₃) nanoparticles-reinforced pure aluminium (Al) on the mechanical properties of hybrid aluminium matrix nanocomposites (HAMNCs).

The HAMNCs were fabricated via a vacuum die-assisted stir casting route by a two-step feeding method. The varying weight percentages of TiO₂ and Y₂O₃ nanoparticles were added as 2.5, 5, 7.5 and 10 Wt.%.

Scanning electron microscope images showed the homogenous dispersion of nanoparticles in Al matrix. The tensile strength by 28.97%, yield strength by 50.60%, compression strength by 104.6% and micro-hardness by 50.90% were improved in HAMNC1 when compared to the base matrix. The highest values impact strength of 36.3 J was observed for HAMNC1. The elongation % was decreased by increasing the weight percentage of the nanoparticles. HAMNC1 improved the wear resistance by 23.68%, while increasing the coefficient of friction by 14.18%. Field emission scanning electron microscope analysis of the fractured surfaces of tensile samples revealed microcracks and the debonding of nanoparticles.

The combined effect of TiO₂ and Y₂O₃ nanoparticles with pure Al on mechanical properties has been studied. The composites were fabricated with two-step feeding vacuum-assisted stir casting.

The study explores the evolution of Indian domestic electronics manufacturing post-economic reforms and also investigates the lack of natural growth stages among Indian start-up/SME electronics manufactures.

The theoretical framework is inspired by Dawar and Frost's survival strategy theory that local companies may follow to overcome competitive threats from MNCs. The study adopts a qualitative methodology, more precisely, a phenomenological approach to walking through policy/regulatory reforms amid market distortions, technological gaps and colonial mindset from the perspective of Indian domestic electronics manufacturers. The study has adopted Gioia method of data analysis to inductively suggest a few research propositions.

The phenomenological approach revealed eight essential structure (essence) narratives to explore the complex issue that plague the industry: make in India, made in India, preferential market access strategy, equitable market access strategy, blue ocean strategy, competitive positioning strategy, technical capability and importance of policy/regulatory arbitrage.

The situation of Indian electronics manufacturing units is comparable to the bonsai tree situation, where natural evolution in business stages does not exist; they are born and die as start-ups/MSMEs. The study advocates for equitable market access by removing market distortions. The long-term solution may lie in making available locally manufactured products as a dependable alternative to the imported products or produced locally by MNC OEMs in terms of cost, quality, technology, volume, after-sale service and integrated supply chain.

While the favorable FDI policies, digital India and make-in India initiatives have strengthened domestic electronics production, it is yet to significantly impact India's position in global trade, including manufacturing and exports.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

Digital supply chains require nascent technologies like blockchain and Internet of Things (IoT). There is a need to develop a roadmap for the implementation of these technologies, as they require a huge amount of resources and infrastructure. The purpose of this paper is to analyze the challenges of implementing blockchain-IoT integrated architecture in the green supply chain and develop strategies for the same.

After a thorough literature survey of Scopus-indexed journals and books, 37 barriers were identified, which were then brought down to 15 barriers after confirming with industry and academic experts using the Delphi method. Using the total interpretive structural modeling (TISM) method and cross-impact matrix multiplication applied to classification (MICMAC) analysis, the barriers were modeled, and finally, strategies were formulated using a concept map to handle the barriers in the blockchain-IoT integrated architecture for a green supply chain.

This paper presents the research on barriers that can be considered for incorporating blockchain and IoT in the green supply chain. It was found from the TISM model that environmental concerns are Level-1 barriers and need to be addressed by developing appropriate technology and allocating funds for the same. An integrated ecosystem with blockchain and IoT is developed.

The focus of this study was on the challenges of blockchain and IoT; hence, it is required to extend the research and find challenges for different industries and also analyze the criteria using other multi-criteria decision-making (MCDM) methods. Further research is required for the integration of blockchain-IoT with supply chain functions.

The transformation of a traditional supply chain into a green supply chain is possible with the integration of technologies. This research work and the strategies developed are useful to managers and practitioners working on technology implementation. Planning resources and addressing key barriers is possible with the concept maps and architecture developed.

Green supply chain management (SCM) is gaining importance in industry as well as the academic sector due to government Policies and norms worldwide for reducing emissions and encouraging environment-friendly production systems. Incorporating blockchain and IoT in a green supply chain will further digitize and increase transparency in supply chains.

We have done a categorization of all barriers based on the expert survey by academicians and industry experts from industries in India. The concept map helps in identifying possible solutions for the challenges and initiatives to be taken for the smooth integration of technologies in the green supply chain.