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1 – 6 of 6David R. Selviah, Andy C. Walker, David A. Hutt, Kai Wang, Aongus McCarthy, F. Anibal Fernández, Ioannis Papakonstantinou, Hadi Baghsiahi, Himanshu Suyal, Mohammad Taghizadeh, Paul Conway, John Chappell, Shefiu S. Zakariyah, Dave Milward, Richard Pitwon, Ken Hopkins, Malcolm Muggeridge, Jeremy Rygate, Jonathan Calver, Witold Kandulski, David J. Deshazer, Karen Hueston, David J. Ives, Robert Ferguson, Subrena Harris, Gary Hinde, Martin Cole, Henry White, Navin Suyal, Habib ur Rehman and Chris Bryson
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect…
Abstract
Purpose
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.
Design/methodology/approach
Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator.
Findings
Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides. Several different laser systems can be used to form waveguide structures by ablation. Establishment of waveguide layout design rules from experimental measurements and modelling enables successful first time layout of complex interconnection patterns.
Research limitations/implications
The complexity and length of the waveguides in a complex backplane interconnect, beyond that achieved in this paper, is limited by the bend loss and by the propagation loss partially caused by waveguide sidewall roughness, so further research in these areas would be beneficial to give a wider range of applicability.
Originality/value
The paper gives an overview of advances in polymer formulation, fabrication methods and CAD tools, for manufacturing of complex hybrid‐integrated OPCBs.
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Keywords
David R. Selviah, F. Aníbal Fernández, Ioannis Papakonstantinou, Kai Wang, Hadi Bagshiahi, Andy C. Walker, Aongus McCarthy, Himanshu Suyal, David A. Hutt, Paul P. Conway, John Chappell, Shefiu S. Zakariyah and Dave Milward
To introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its…
Abstract
Purpose
To introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations, fabrication techniques, layout design rules and characterisation techniques for hybrid electronic and optical printed circuit boards (PCBs) using multimode polymer optical waveguide interconnects.
Design/methodology/approach
The authors are investigating a number of different fabrication techniques which they compare with each other and with modelled calculations of waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing.
Findings
A number of design rules for polymer multimode waveguides have been found and published. Techniques for ink jetting polymer to print waveguides and laser ablation techniques have been developed. New formulations of polymer which cure faster for direct writing have also been developed.
Research limitations/implications
Further work is needed to thicken the ink jet printed polymer and to investigate side wall roughness of the ablated waveguides and development of new polymer formulations for dry film. Further research is also needed on construction of prototype system demonstrators.
Practical implications
The fabrication techniques being developed are designed to be transferred to industrial PCB manufacturers to enable them to make higher value optical PCBs. The design rules being discovered are being entered into commercial PCB layout software to aid designers of optical PCBs.
Originality/value
The paper is of interest to PCB manufacturers who wish to upgrade their processes to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list.
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Richard C.A. Pitwon, Ken Hopkins, Dave Milward, Malcolm Muggeridge, David R. Selviah and Kai Wang
The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low‐cost assembly…
Abstract
Purpose
The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low‐cost assembly methods.
Design/methodology/approach
A novel method of high‐precision passive alignment and assembly to OPCBs was invented and a full evaluation platform developed to demonstrate the viability of this technique.
Findings
The technique was successfully deployed to passively align and assemble a lens receptacle onto an embedded polymer waveguide array in an electro‐OPCB. The lens receptacle formed a critical part of a dual lens pluggable in‐plane connection interface between peripheral optical devices and an OPCB. A lateral in‐plane mechanical accuracy of ±2 μm has been measured using this technique.
Research limitations/implications
As this is a free space optical coupling process, surface scattering at the exposed waveguide end facet was significant.
Originality/value
This paper details a novel method of passively assembling arbitrary optical devices onto multi‐mode optical waveguides and outlines the procedure and equipment required. A lens coupling solution is also presented which reduces susceptibility of a connecting optical interface to contamination.
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Shefiu S. Zakariyah, Paul P. Conway, David A. Hutt, Navin Suyal and David R. Selviah
The purpose of this paper is to present the need, and a potential solution, for in‐plane routing of optical signals for optical‐enabled circuit boards.
Abstract
Purpose
The purpose of this paper is to present the need, and a potential solution, for in‐plane routing of optical signals for optical‐enabled circuit boards.
Design/methodology/approach
Multimode waveguides and integrated 45° in‐plane mirror structures were made in a low loss acrylate‐based photopolymer using excimer laser ablation. The fabrication of multimode waveguides and mirrors was carried out in a single laser system which minimised alignment issues.
Findings
It was established that in‐plane mirror fabrication using laser ablation can be achieved and can potentially be used to define mirrors in waveguides made by other methods such as photolithography.
Research limitations/implications
While the concept (integrated in‐plane mirror) was demonstrated, the viability of its deployment will depend on the results of optical loss measurements for which further research is required.
Originality/value
The paper gives an overview of the design concept and fabrication steps for an in‐plane embedded mirror.
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Keywords