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After slicing and dicing their way to the '90s, American corporations are finding that job‐cutting is really a double‐edged sword.

The purpose of this paper is to identify and expand upon the understanding of the reliability of high density interconnect (HDI) technologies containing multi‐level microvia interconnections with 2, 3 or 4 stacked and staggered configured structures.

Microvia testing was performed with interconnect stress testing (IST) using a modified methodology documented in the IPC test methods manual TM650, Method 2.6.26, titled DC current induced thermal cycle test. The IST coupon designs utilize mathematical modeling, in combination with prior experience in the fields of printed wiring board (PWB) processing, chemistry, materials and statistics, to improve the sensitivity of testing.

Single and 2 stack microvias are generally the most robust type of copper interconnection used in HDI applications, 3 stack and 4 stack require greater discipline to assure product reliability. Ranking the inherent reliability of 3 stack and 4 stack structures to other interconnects like plated through holes, blind, or buried vias, may need to be reconsidered in future reliability test programs.

This work was focused on the reliability of bare board and does not address failure modes associated with the additional stresses applied to the microvia structures created by the devices and their associated solder joints formed during surface mount assembly and rework operations.

This paper was written to improve the understanding of various aspects of design and their influence on reliability for stacked and staggered microvia structures. The design function must understand the physical construction as a critical influence on microvia reliability that should be taken into consideration in parallel with the electrical requirements.

Creativity is an important skill for design teams to reach new and useful solutions. Designers often use one or more of creativity and innovation techniques (CITs) to achieve the desired creative potential during new product development (NPD). The selection of adequate CITs requires considerable expertise, given the multiple application contexts and the extensive number of techniques available. The purpose of this study is to present a creativity support system able to manage this amount of information and provide valuable knowledge to improve NPD.

This study presents a knowledge-based system prototype using artificial intelligence (AI) to support knowledge management on the selection of CITs for design. CITs assertion is modelled through a double inference process using five categories, correlating over 500 different entry scenarios to 24 implemented CITs. The techniques are classified according to: design stage, innovation focus, team relationship, execution method and difficult of use. Prototype outputs explanations on the inference process and chosen techniques information.

To demonstrate the system scope, two opposite design cases are presented. The system was validated by experts in knowledge management and mechanical engineering design. The validation process demonstrates relevance of the approach and improvement directions for future developments.

Though literature contains toolkits and taxonomy for CITs, no work applies AI to identify design scenarios, select best CITs and instruct about their use. Validators reported to know less than half of the available techniques, showing a clear knowledge gap among design experts.

While the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes fabricated with these electroless copper alternatives remains in question. However, during the last three years, significant process improvements have been made in the direct metalization process based on a patented dispersion of graphite. This paper will describe the technology in detail and present data on the reliability and versatility of the graphite based direct metalization process.