Table of contents
Maximising throughput of the component assembly process
Alan NesbitThis paper considers how the throughput of the component assembly process can be maximised by the use of software tools. Optimum results are achieved if the tools provide an…
Microstructure of solder joints with electronic components in lead‐free solders
Yoshikazu Nakamura, Yoshinori Sakakibara, Yoshihisa Watanabe, Yoshiki AmamotoThe microstructure of the Sn‐3.5wt%Ag/Cu and Sn‐9.0wt%Zn/Cu interfaces after soldering at 250°C was evaluated. The cross‐sections were investigated using a scanning electron…
The application of IR thermography to process monitoring and control of reflow soldering
Paul Conway, David Whalley, Michelle Wilkinson, S.M. HyslopThis paper describes a technique for the monitoring and control of the reflow soldering process. The technique combines state‐of‐the‐art infra‐red (IR) sensor technology, coupled…
Lead‐free alloys
Anton Zoran Miric, Angela GrusdIn recent years, efforts to develop alternatives to lead‐based solders have increased dramatically. These efforts began as a response to potential legislation and regulations…
Solder joint reliability of cavity‐down plastic ball grid array assemblies
S.‐W. Ricky Lee, John H. LauA computational model was established in this study to simulate cavity‐down plastic ball grid array (PBGA) assemblies. Stress analysis was performed to investigate the solder…
Surface mount assembly of BGA and μBGA
Volker‐Ekkehart KochA ball grid array (BGA) is a surface‐mount device and is processed in a standard surface‐mount (SM) assembly line. However, there are some special features which make it different…
Mechanical properties of Pb/Sn Pb/In and Sn‐In solders
W. Kinzy Jones, Yanqing Liu, Milind Shah, Robert ClarkeThe mechanical properties of eight solder alloys from the Pb‐Sn‐In‐Ag alloy systems were determined over the temperature range ‐200°C to 100°C, using uniaxial tensile tests…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang