Microstructure of solder joints with electronic components in lead‐free solders

Yoshikazu Nakamura (Department of Materials Science and Engineering, National Defense Academy, Yokosuka, Kanagawa, Japan)
Yoshinori Sakakibara (Department of Materials Science and Engineering, National Defense Academy, Yokosuka, Kanagawa, Japan)
Yoshihisa Watanabe (Department of Materials Science and Engineering, National Defense Academy, Yokosuka, Kanagawa, Japan)
Yoshiki Amamoto (Department of Materials Science and Engineering, National Defense Academy, Yokosuka, Kanagawa, Japan)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 April 1998

Abstract

The microstructure of the Sn‐3.5wt%Ag/Cu and Sn‐9.0wt%Zn/Cu interfaces after soldering at 250°C was evaluated. The cross‐sections were investigated using a scanning electron microscope and energy dispersive X‐ray to determine the interface layer structure and composition. Even though the cooling rate from soldering temperature to room temperature is rapid, this study indicates that the intermetallic compound is formed at the interface between the solder and the copper substrate for both the Sn‐3.5wt%Ag and the Sn‐9.0wt%Zn lead‐free solders.

Keywords

Citation

Nakamura, Y., Sakakibara, Y., Watanabe, Y. and Amamoto, Y. (1998), "Microstructure of solder joints with electronic components in lead‐free solders", Soldering & Surface Mount Technology, Vol. 10 No. 1, pp. 10-12. https://doi.org/10.1108/09540919810203748

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Publisher

:

MCB UP Ltd

Copyright © 1998, MCB UP Limited

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