Maximising throughput of the component assembly process

Alan Nesbit (Software Engineering Consultant, Zuken‐Redac, Tewkesbury, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 April 1998

Abstract

This paper considers how the throughput of the component assembly process can be maximised by the use of software tools. Optimum results are achieved if the tools provide an automatic, detailed analysis of the assembly process while providing the engineer with the opportunity to use his experience to further enhance any automatically generated results. The tools must consider the assembly process as a whole, rather than each stage in the process independently, in order to gain maximum benefit. Finally, the tools must be flexible enough to be able to perform an accurate analysis for all assembly environments.

Keywords

Citation

Nesbit, A. (1998), "Maximising throughput of the component assembly process", Soldering & Surface Mount Technology, Vol. 10 No. 1, pp. 6-9. https://doi.org/10.1108/09540919810203685

Download as .RIS

Publisher

:

MCB UP Ltd

Copyright © 1998, Company

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.