Keywords
Citation
(2006), "Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems", Soldering & Surface Mount Technology, Vol. 18 No. 4. https://doi.org/10.1108/ssmt.2006.21918dad.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2006, Emerald Group Publishing Limited
Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems
Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems
Keywords: Heat transfer, Thermal conductivity
Available from thermal management expert Laird Technologies are advanced thermally conductive gap fillers to provide highly effective heat removal in a wide range of electronics applications.
Such thermally conductive gap fillers can provide the perfect solution to difficult thermal management problems that electronic product designers often encounter today. Typically, the products will enhance the thermal performance of an electrical system by effectively filling gaps between electronic component and substrate (such as a heat sink), while providing good heat transfer.
Laird Technologies' thermally conductive gap fillers are future generation compliant cooling materials, and are the softest and highest thermally conductive products currently available. These advanced materials offer engineers and designers the greatest flexibility in dimensional tolerances.
Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs.
The products in the range comprise the T-flex(TM) 300, T-pli(TM) 200, T-flex(TM) 200 V0, T-flex(TM) 500, T-flex(TM) 600, T-putty(TM) 502 Series, and the T-putty(TM) 504 Series. T-flex(TM) 300 Series is an ultra compliant, thermal gap filler for high-speed computing and telecommunications applications, while the T-pli(TM) 200 Series is the industry leading soft elastomer gap filler. T-flex(TM) 200 V0 is a commercial grade elastic gap filler, while the T-flex(TM) 500 and 600 Series provide highly compressible thermal gap fillers with 2.8 and 3.0W/mK thermal conductivities, respectively.
Finally, there is the T-putty(TM) 502 and 504 Series. These are ultra compressible thermal gap fillers, and the 502 Series provides 3.0W/mK thermal conductivity, while the 504 series is a dispensable silicone gel thermal gap-filling product.
Specific applications for Laird Technologies' thermally conductive gap fillers include use in the electronics content of notebook computers, handheld microprocessor devices, telecommunications hardware, semiconductor test equipment, servers and desktop computers, memory modules, mass storage devices, power conversion equipment, flat panel displays, and audio and video components.
The products are available in thicknesses ranging from 0.25 to 5.08mm.
About Laird Technologies
Laird Technologies is the world's leading designer and manufacturer of electromagnetic interference (EMI) shielding, telematics, thermal management and wireless antenna solutions for the telecommunications, data-communications, computer, general electronics, network equipment, aerospace, defence, automotive and medical equipment industries.