Faster electrical potting and sealing with new light curing adhesives

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2000

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Keywords

Citation

(2000), "Faster electrical potting and sealing with new light curing adhesives", Soldering & Surface Mount Technology, Vol. 12 No. 3. https://doi.org/10.1108/ssmt.2000.21912cad.018

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Faster electrical potting and sealing with new light curing adhesives

Faster electrical potting and sealing with new light curing adhesives

Keywords Intertronics, Curing, Adhesives

Intertronics has a range of Dymax light curing adhesives specifically formulated for thin layer potting and sealing. Curing in seconds on exposure to longwave UV and visible light, the adhesives are ideal for capacitors, connectors, temperature probes, sensors and thermal switches, in addition to tamperproofing. Clear grades can cure to depths in excess of 12mm, whilst the adhesives are also available in red, blue and fluorescing grades. Single-component, Dymax light curing potting adhesives eliminate the need for metered mixing, simplify dispensing, eliminate waste and feature virtually unlimited pot life. The shelf life of packaged adhesives at room temperature is up to one year.

Adhesive strengths on metal are up to 20N/mm2, with bond lines in plastic assemblies often exceeding the strength of the substrate. Inherent toughness and resistance to vibration, humidity, moisture and thermal shock make a considerable contribution to the quality and durability of the finished product.

Dymax potting adhesives are available in a range of viscosities to match dispensing requirements. Thixotropic, high viscosity adhesives eliminate stringing and permit precision dispensing, whilst lower viscosity formulations rapidly fill pot cavities.

Further information: Intertronics on +44 (0) 1865 842842 or visit http://www.intertronics.co.uk

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