New 'active' conductive ink from Multicore has fast single-step cure process

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 1999

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Keywords

Citation

(1999), "New 'active' conductive ink from Multicore has fast single-step cure process", Soldering & Surface Mount Technology, Vol. 11 No. 2. https://doi.org/10.1108/ssmt.1999.21911bad.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


New 'active' conductive ink from Multicore has fast single-step cure process

New "active" conductive ink from Multicore has fast single-step cure process

Keywords Inks, Multicore, Thick film, Soldering

Polymet™ from Multicore Solders Inc. is a new generation of directly solderable conductive polymer thick film that requires no post cure step. Designed for making full additive circuitry or modifying conventional PCBs, Polymet™ is also suitable for creating vertical interconnects in build-up and HDI applications. The screen primable ink will be officially launched at IPC Expo 99.

Polymet is a sophisticated blend of metals, polymers and intelligent flux/hardener chemistry that forms "micro-chains" of continuous metal within an epoxy matrix firmly bonded to a substrate such as bare FR4. The same mechanism produces true metallurgical joints between the ink and PCB lands, component terminations etc., yielding radically improved conductivity and stability over conventional inks which rely solely on particle to particle contact.

Processing is accomplished in about four minutes and no post cure stage is necessary, providing a production efficiency and energy benefit over earlier similar technology. Thermal stress on the substrate is minimised and the Polymet ink becomes completely stable during subsequent cure cycles, thus enabling multi-layer realisations.

Polymet is a rapid, easy prototyping, pre-production and development tool and also provides an elegant, robust and CAD compatible alternative to hand soldered "jumper wires".

For further information please contact: Les Evans, Multicore Solders Ltd, Kelsey House, Wood Lane End, Hemel Hempstead, Hertfordshire HP2 4RQ, UK. Tel: +44 (0) 1442 233233; Fax: +44 (0) 1442 269554; Email: LGEvans@Compuserve.com

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