Keywords
Citation
(2002), "Thermal & mechanical simulation and experiments in micro-electronics and micro-systems", Microelectronics International, Vol. 19 No. 3. https://doi.org/10.1108/mi.2002.21819cab.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Thermal & mechanical simulation and experiments in micro-electronics and micro-systems
Keyword: Microelectronics
April 6-9, 2003, Aix en Provence, France
After three successful editions of the EuroSimE conference, a fourth edition is planned in 2003 and will take place in the beautiful Province in the South of France. This EuroSimE 2003 will address the results of both fundamental research and industrial application for thermal, mechanical and thermo- mechanical solutions of (micro)-electronics, focusing on advanced simulation and experiments. The conference will include keynote presentations and sessions with a wide range of topics.
Short courses (April 6) will be offered for professional training. The subjects will be announced later.
Three days of technical sessions (April 7-9) for oral and poster presentation. A parallel exhibition from industrial contributors, simulation and optimization software companies.
You are invited to submit an abstract of about 500 words by fax, mail, or E-mail describing the scope, content, and key points (originality, specific results, potential impact) of your proposed paper.
Abstracts must be received by October 15, 2002. Authors will be notified by December 1, 2002.
Deadline for the final manuscript is January 28, 2003.