MRSI 505 opens eutectic die attach lab facility

Citation

(2000), "MRSI 505 opens eutectic die attach lab facility", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cab.007

MRSI 505 opens eutectic die attach lab facility

MRSI 505 opens eutectic die attach lab facility

Keywords MRSI, Die bonding, Testing, Eutectic solder

Electronics manufacturers assembling microwave, optical and RF modules, as well as other advanced packages requiring eutectic die attach processes, now have a resource for process development at MRSI headquarters in Chelmsford, MA. MRSI has opened a eutectic die attach lab facility and demo facility in the company's engineering department, where customers will be able to test their products with the help of engineering staff and dedicated equipment, including the MRSI 505 Assembly Work Cell. This flexible system supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed loop temperature control, programmable up to 450°C, for eutectic bonding. The MRSI 505 is said to be the industry leader for ultra precision die placement for epoxy die attach and eutectic bonding. Visitors to the facility will be able to investigate both the process of direct gold silicon eutectic die attach, as well as gold tin or gold germanium reflow, and other options.

For more information, or to set up an appointment to use the facility, contact: MRSI at 25 Industrial Avenue, Chelmsford, MA 01824, USA. Tel: (978) 256 4950; Fax: (978) 256 5120; E-mail: sales@mrsigroup.com; Web site: www.mrsigroup.com