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Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
SEC introduces motorized image sweeping, rotating die collet on bonders
Keywords Semiconductor Equipment Corporation, Bonding
Semiconductor Equipment Corporation has enhanced the means of achieving pick and place precision of the company's semiautomatic Model 860 Omni flip chip and laser diode bonders by incorporating a standard features option package consisting of a motorized image sweeping movement with a motorized rotating collet on the pick-up tool for the die.
According to SEC, the new alignment features package facilitates perimeter viewing of the die bumps with the landing site on the substrate and provides effortless theta centering of the die held by the pick-up tool during the alignment process. The latter is particularly useful when placing die into packages presented in an Auer boat. The motorized image sweeping movement and rotating collet are both controlled via the same electronic joystick that is used for operating the system's cube beam splitter viewing system. The two features also can be ordered as a special option on the company's low cost semiautomatic Model 850 flip chip bonder.