Mintech raises wafer stakes

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000

Keywords

Citation

(2000), "Mintech raises wafer stakes", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bab.016

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Mintech raises wafer stakes

Keywords Mintech Semiconductors, Die Technology, Management buyouts

Announced this month, Graham White has completed a MBO of Mintech Semiconductors Ltd from the former Mintech Technology Group. Mr White also added Die Technology Ltd to his new business venture. Graham commented, "This has been a fantastically busy period with exciting times to follow. I chose to complete the Mintech Semiconductors MBO at the same time as purchasing our then competitor Ditech". Graham added, "Mintech and Ditech together are such a strong combination for the die market in Europe, providing customers a true No. 1 for choice". The Mintech facility is located in Norwich, employing over 35 people with an expected turnover in year 2000 of $4 million. Ditech is located in Oldham, Manchester, where 20 people are based and has an expected turnover of $3.5 million.

"The strengths of Mintech are in Europe with its extensive customer base dealing directly with OEMs. Ditech's strength is in the USA and has its own distinctive customer base. This, coupled with the existing custom packaging business at Mintech will make us a truly intemational organisation", adds Graham.

The joint size of the two organisations is in excess of $7.5 million.

"Our purchasing power now is unrivalled. With the manufacturers that we represent along with our technical expertise, I believe we can fully support all our customers' requirements", said Joanne Hawes, Mintech's sales and purchasing co-ordinator.

Mintech and Ditech are semiconductor die assessors, with the ability to assess, qualify, test and probe wafers and unencapsulated semiconductor die. They supply product in either die or wafer form or custom packaged to customers exact requirements.