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Article

Ryszard Kisiel, Marek Guziewicz, Andrzej Taube, Maciej Kaminski and Mariusz Sochacki

This paper aims to investigate the sintering and solid liquid interdiffusion bonding (SLID) techniques to attach AlGaN/GaN-on-Si chips to direct bond copper (DBC…

Abstract

Purpose

This paper aims to investigate the sintering and solid liquid interdiffusion bonding (SLID) techniques to attach AlGaN/GaN-on-Si chips to direct bond copper (DBC) substrate. The influence of metal layers deposited on the backside of AlGaN/GaN-on-Si dies on the assembly process is also investigated.

Design/methodology/approach

The authors assumed the value of the shear strength to be a basic parameter for evaluation of mechanical properties. Additionally, the surface condition after shearing was assessed by SEM photographs and the shear surface was studied by X-ray diffraction method. The SLID requires Sn-plated DBC substrate and can be carried out at temperature slightly higher than 250°C and pressure reduced to 4 MPa, while the sintering requires process temperature of 350°C and the pressure at least 7.5 MPa.

Findings

Ag-, Au-backside covered high electron mobility transistor (HEMT) chips can be assembled on Sn-plated DBC substrates by SLID technology. In case of sintering technology, Cu- or Ag-backside covered HEMT chips can be assembled on Ag- or Ni/Au-plated DBC substrates. The SLID process can be realized at lower temperature and decreased pressure than sintering process.

Research limitations/implications

For SLID technology, the adhesion between Cu-backside covered HEMT die and DBC with Sn layer loses its operational properties after short-term ageing in air at temperature of 300°C.

Originality/value

In the SLID process, Sn-Cu and Sn-Ag intermetallic compounds and alloys are responsible for creation of the joint between Sn-plated DBC and micropowder Ag layer, while the sintered joint between the chip and Ag-based micropowder is formed in diffusion process.

Details

Circuit World, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0305-6120

Keywords

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Article

Andrew Richardson, Chris Bailey, Jean Marc Yanou, Norbert Dumas, Dongsheng Liu, Stoyan Stoyanov and Nadia Strusevich

To present key challenges associated with the evolution of system‐in‐package technologies and present technical work in reliability modeling and embedded test that…

Abstract

Purpose

To present key challenges associated with the evolution of system‐in‐package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges.

Design/methodology/approach

Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics.

Findings

Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF‐MEMS switch identified as an SiP component presenting a key test challenge.

Research limitations/implications

Results will contribute to the further development of NXP wafer level system‐in‐package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution.

Originality/value

Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF‐MEMS switch.

Details

Circuit World, vol. 33 no. 1
Type: Research Article
ISSN: 0305-6120

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Article

Yunhui Mei, Gang Chen, Xin Li, Guo‐Quan Lu and Xu Chen

The purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano‐silver assembly when it is cooled to room temperature from the…

Abstract

Purpose

The purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano‐silver assembly when it is cooled to room temperature from the sintering temperature (normally 275°C); how the cyclic temperature load affects the residual curvature or stresses in sintered joint. Then the stress level and the reliability of sintered nano‐silver for high‐temperature applications can be understood.

Design/methodology/approach

5 mm * 2.5 mm silicon chip was bonded with 96 per cent Al2O3 substrate by sintering nanosilver paste. An optical system was developed to measure the curvature of the sintered assemblies. Reliability of the sintered assemblies was evaluated by temperature cycling of −40∼125°C. Finite element analysis was employed to simulate the behavior of the joint subjected to the temperature cycling from −40°C to 125°C by ANSYS. SEM images were taken to investigate the impact of temperature cycling on the reliability of sintered silver attachment.

Findings

This residual bending at room temperature was found concave towards the substrate (alumina) side. Also, with the bondline thickness increasing, the residual curvature decreases obviously. The severity of the residual bending in all the structures was mitigated to some extent with increasing number of cycles. There is no crack in the joint with the thickness of 25 μm. The drop of the residual curvature of the samples with bondline of 25 μm is caused mainly by stress relaxation in sintered silver before 300 cycles. Sample with thicker bondline is more susceptible to thermal cycling for the structure bonded with nanosilver than that with thinner bondline. The poor quality of bonding is due to the thicker sintered joint, which means that sintered nanosilver is not suitable for die‐attachment requiring thick bondline.

Originality/value

The paper describes: how a precise optical system was developed to measure the residual curvature of the sintered assemblies; how the evolution of the residual curvature of the sintered assembly with the temperature cycling was obtained by both experiment and simulation; and how microstructures of the sintered silver joint were analyzed for as‐sintered assembly and the sintered assembly after temperature cycling.

Details

Soldering & Surface Mount Technology, vol. 25 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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Article

George K. Chacko

Develops an original 12‐step management of technology protocol and applies it to 51 applications which range from Du Pont’s failure in Nylon to the Single Online Trade…

Abstract

Develops an original 12‐step management of technology protocol and applies it to 51 applications which range from Du Pont’s failure in Nylon to the Single Online Trade Exchange for Auto Parts procurement by GM, Ford, Daimler‐Chrysler and Renault‐Nissan. Provides many case studies with regards to the adoption of technology and describes seven chief technology officer characteristics. Discusses common errors when companies invest in technology and considers the probabilities of success. Provides 175 questions and answers to reinforce the concepts introduced. States that this substantial journal is aimed primarily at the present and potential chief technology officer to assist their survival and success in national and international markets.

Details

Asia Pacific Journal of Marketing and Logistics, vol. 14 no. 2/3
Type: Research Article
ISSN: 1355-5855

Keywords

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Article

Jan Felba

This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging.

Abstract

Purpose

This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging.

Design/methodology/approach

Based on the literature and author’s own experience, the factors influencing the nanosized Ag particle sintering results were identified, and their significance was assessed.

Findings

It has been shown that some important technological parameters clearly influence the quality of the joints, and their choice is unambiguous, but the meaning of some parameters is dependent on other factors (interactions), and they should be selected experimentally.

Originality/value

The value of this research is that the importance of all technological factors was analyzed, which makes it easy to choose the technological procedures in the electronic packaging.

Details

Circuit World, vol. 44 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

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Article

Carolyn J. Cordery, Carolyn J. Fowler and Khairil Mustafa

The purpose of this paper is to explore the factors influencing the non‐adoption of Extensible Business Reporting Language (XBRL) technology.

Abstract

Purpose

The purpose of this paper is to explore the factors influencing the non‐adoption of Extensible Business Reporting Language (XBRL) technology.

Design/methodology/approach

This exploratory study analyses interview data obtained from key XBRL stakeholders on the relative importance of environmental, organisational and technological context factors to ascertain why adoption has not occurred.

Findings

The research finds three reasons for XBRL non‐adoption. First, the lack of a government “push” for XBRL technology results in organisational ignorance. Second, it appears that organisations do not believe that XBRL will beneficially reduce compliance costs. Third, complexity in developing the structured language (taxonomy) for XBRL use has significant budgetary implications.

Research limitations/implications

As qualitative research, this study does not claim to be generalisable or objective. However, the rich data were analysed from a diverse group of interviewees experienced and knowledgeable in respect of XBRL development and adoption.

Social implications

Governments' promises to reduce organisational compliance costs may be a reason for them to invest extensive taxpayers' dollars into XBRL. However, organisations are sceptical they will benefit, requiring government to “push” the technology. Until government servants can forecast the real benefits to argue for increased budgets to develop a comprehensive taxonomy, widespread adoption of XBRL is unlikely to occur.

Originality/value

The non‐adoption of XBRL highlights the difficulties encountered when enthusiastic professionals can see the potential of a business solution, and yet are impotent to execute it. Environmental and technological contextual factors need to “push” organisations, as with XBRL, organisations do not demand, or “pull”, the technology.

Details

Pacific Accounting Review, vol. 23 no. 1
Type: Research Article
ISSN: 0114-0582

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Article

John Maxymuk

Perhaps the one constant in every business is the need to cope with technological change, and libraries are no exception. In fact, libraries may be one of the most…

Abstract

Perhaps the one constant in every business is the need to cope with technological change, and libraries are no exception. In fact, libraries may be one of the most affected industries – with technological change impacting not only how libraries do business, but also what services they provide and how collections are built and maintained. While reading this brief history of the various technologies that have gone the way of the Dodo, librarians are asked to contemplate how they keep themselves relevant in our ever‐evolving technological world of information access.

Details

The Bottom Line, vol. 17 no. 3
Type: Research Article
ISSN: 0888-045X

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Article

Jerald Savin and David Silberg

When integrated accounting packages were the only game in town, the finance department held strategic data hostage. This is no longer the case.

Abstract

When integrated accounting packages were the only game in town, the finance department held strategic data hostage. This is no longer the case.

Details

Journal of Business Strategy, vol. 20 no. 3
Type: Research Article
ISSN: 0275-6668

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Article

Suman Selvarajoo, Raja Ariffin Raja Ghazilla and Azuddin Mamat

The purpose of this paper is to understand the current practices of tool and die development, particularly in the Malaysian context with respect to collaborative…

Abstract

Purpose

The purpose of this paper is to understand the current practices of tool and die development, particularly in the Malaysian context with respect to collaborative manufacturing (CM). It is important to gauge the presents of CM, which is one of the key elements of Industrial Revolution 4.0 (IR 4.0) so that significant initiatives could be taken. The findings are also expected to address the issues pertaining limited information related to collaborative tool and die development in Malaysia.

Design/methodology/approach

A survey was carried out among the key players in the local tool and die industry, covering issues such as operational structure in practice, internal collaboration, external collaboration and application of collaborative technology.

Findings

The results revealed that although practitioners realise that there are systems and available technological support, unfortunately, it has not been embraced due to poor communication, lack of commitment and cooperation from employees and business owners. In addition, industry players also need to be aware of the benefits concerning CM for a sustainable future.

Research limitations/implications

Many industry players are rather reluctant to participate in surveys and tend to reserve their opinions regarding their operational practices. Lack of awareness among the industry players contributed to the poor participation of the survey and based on the feedback, some of the industry players are not well-informed regarding the latest developments in the industry.

Originality/value

The data and feedback gained through the research offer the perspective for the current state of CM particularly the tool and die industry in Malaysia. This may be a preliminary study with limited data but the value of the information is significant for further in-depth study and policy alignment towards enhancing the tool and die industry which is rarely given attention to. Understanding the current state of CM particularly in the tool and die development would be critical for the expansion of IR 4.0 concerning this field in Malaysia.

Details

Journal of Manufacturing Technology Management, vol. 32 no. 2
Type: Research Article
ISSN: 1741-038X

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Article

M.B. Vincent and C.P. Wong

This paper presents results on adding silane coupling agents to the underfill encapsulant to enhance the rheology and wetting of the underfill. These results include…

Abstract

This paper presents results on adding silane coupling agents to the underfill encapsulant to enhance the rheology and wetting of the underfill. These results include rheology measurements, contact angle measurements, and in situ flows using a simulated test chip on an FR4 with solder mask substrate. Three properties of the underfill encapsulant that can affect the mechanical reliability of the die and substrate assembly are: CTE; elastic modulus; and adhesion to the die and substrate surfaces. The approach taken in this paper is to add silane coupling agents with different chemistries to the underfill encapsulant to provide interfacial coupling of the underfill material to different die and substrate materials. This paper presents results on the enhancement of the adhesion of underfill encapsulant to silicon (Si), silicon nitride (SiN) die passivation, benzocyclobutene (BCB) die passivation, and solder mask surfaces. The adhesion strength was measured by die shear testing.

Details

Soldering & Surface Mount Technology, vol. 11 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

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