Recommended reading for microelectronics technologists

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000

Keywords

Citation

(2000), "Recommended reading for microelectronics technologists", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.008

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Recommended reading for microelectronics technologists

Recommended reading for microelectronics technologists

Keywords: Publication, Multicore, Encapsulation, Underfill

Martin Bartholomew, development manager at Multicore Solders Advanced Products Division, is celebrating the publication of his first book. An Engineer's Handbook of Encapsulation and Underfill Technology, published by Electrochemical Publications, was launched at the International Microelectronics & Packaging (IMAPS) conference in Harrogate, UK (Plate 4).

"The book is conceived as a definitive guide to selecting and using encapsulant materials," said Martin as he signed launch copies of the book on the Multicore Solders booth at IMAPS 99. "A wide range of generic encapsulant materials is now available, enabling high performance, reliable microelectronic devices to be produced at much lower cost than traditional hermetic packaging."

Plate 4Less wistful than a Rosamund Pilcher novel, but almost certainly more influential in its field: Martin Bartholomew, pictured right, of Multicore Solders launched his first book, An Engineer's Handbook of Encapsulation and Underfill Technology, at IMAPS 99

The book provides a comprehensive guide to this exciting technology, beginning with an introduction to the materials and techniques involved, and moving on to examine the structure and properties of resin encapsulants, before analysing failure mechanisms in encapsulated semiconductor devices. Further essential knowledge for the successful application of encapsulant technology is discussed in following chapters, which cover the properties required of suitable encapsulant materials, test methods and processing considerations. The book also describes new developments in encapsulant and underfill technology, ensuring the reader is fully appraised with an up-to-the-minute picture of where the technology is at.

Martin Bartholomew has been involved in semiconductor packaging development, including work for major component manufacturers, since obtaining his BSc in Materials Science from Bath University, UK in 1973. He also managed the technical activities in the EU 462 Pepite MCM programme for TWI, and developed and conducted TWI training courses in die attach and COB technologies. He joined Multicore Solders' Advanced Products Division in June 1996. He has authored several papers in the field of microelectronics packaging and is a regular presenter at worldwide seminars, conferences and workshops.

For further information contact: Electrochemical Publications Ltd. Tel: +44 (0) 1624 834941; Fax: +44 (0) 1624 835400; WWW: http://www.elchempub.com