Enthone-OMl opens high volume copper manufacturing facility

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000




(2000), "Enthone-OMl opens high volume copper manufacturing facility", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.005



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Enthone-OMl opens high volume copper manufacturing facility

Enthone-OMl opens high volume copper manufacturing facility

Keywords: Enthone-OMI, Electrodeposition, Copper

Enthone-OMl Inc. recently completed the construction of a high volume manufacturing facility for its semiconductor grade, high purity copper electrodeposition processes.

Located in West Haven, USA, the 1,000 square foot facility represents a $750,000 investment claims to meet the demanding manufacturing requirements of semiconductor manufacturers worldwide. The facility exceeds Class 1000 packaging and features computer integrated manufacturing, including online particle count. Coupled with fully automated, enclosed chemical distribution and dedicated processing streams, the new facility ensures stringent batch-to-batch control and consistency.

Enthone-OMI claims that its commitment to the semiconductor industry is further evidenced by the wafer scale application development laboratory opened in 1997. The lab allows the company to evaluate copper interconnect, flip chip and bump plating requirements in a tool scale environment. In the last two years over $1.5 million in new manufacturing and technical resources have been dedicated to supporting the semiconductor industry.

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