The Nordic Electronics Packaging Guideline

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000




(2000), "The Nordic Electronics Packaging Guideline", Microelectronics International, Vol. 17 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

The Nordic Electronics Packaging Guideline

The Nordic Electronics Packaging Guideline

Keywords: Internet, Electronics packaging, IMAPS

In a joint Nordic effort, an electronic guideline on electronics packaging has been created and put on the worldwide-web as a service to the electronics industry. The Guideline, which was officially launched on 7 June in conjunction with the 1999 IMAPS UK conference has been jointly developed by IVF and fellow research institutes in the Nordic countries, e.g. Delta (Denmark), Sintel (Norway), and VTT Electronics (Finland). The Nordic Electronics Packaging Guideline covers the following packaging concepts:

  • wirebonding;

  • ball grid arrays;

  • chip scale packages;

  • polymer bonding;

  • multi-chip-modules; and

  • flip-chip technology.

The Guideline discusses design, assembly, manufacturing, test, and quality aspects of these interconnect methods; including equipment and the applications that use these technologies. The project was financially supported by The Nordic Industrial Fund and co-ordinated by Technoconsult, Denmark. Bookmark the guideline address,, and pay us a visit now! For further information, please contact Roger Rorgren at IVF. E-mail:

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