(1999), "IMAPS Nordic", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.004
Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Keywords IMAPS, Nordic
Call for Abstracts The IMAPS Nordic 36th Annual Conference Fiskartorpet/Kalastajatorppa, Helsinki, Finland 19-22 September 1999
Speakers were invited to submit a free format abstractto the 36th Annual Conference. The abstract was to be non-commercial and submitted in electronic form to the IMAPS Nordic (email@example.com) no later than 20 April 1999. Speakers will be notified of paper acceptance by e-mail 20 May 1999. The deadline for the final paper is 20 July 1999.
Proposed topics include: microelectronics applications; ceramics for future electronics; manufacturing processes; bare die, MCM and 3D packaging; CSP and flipchip; 3D moulded interconnect devices; EU ban of Pb and halogens; MEMs, micro electro mechanical systems; trends in telecommunications; using unique materials; high frequency packaging; BGAs in real life production; environmentally sound electronics; advanced interconnect, encapsulation; future electronics, strategies and R&D.
For the latest information about the conference and the exhibition check our home page at WWW.IMAPSNORDIC.A.SE or contact the exhibitor host at firstname.lastname@example.org