Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately.
A hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided.
An aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption.
Periodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable.
Xi, R., Yu, J., Cao, L., Zheng, X. and Guo, J. (2021), "Cleaning control of stencil printing subject to performance deterioration", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 151-158. https://doi.org/10.1108/SSMT-12-2019-0043
Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited