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Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Norliza Ismail (Pusat Pengajian Fizik Gunaan, Fakulti Sains and Teknologi, Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Azman Jalar (Pusat Pengajian Fizik Gunaan, Fakulti Sains and Teknologi, Universiti Kebangsaan Malaysia, Bangi, Malaysia and Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Maria Abu Bakar (Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Roslina Ismail (Division of Fine Arts, Cultural Centre, Universiti Malaya, Kuala Lumpur, Malaysia)
Najib Saedi Ibrahim (Red Ring Solder (M) Sdn.Bhd, Selangor, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 11 February 2020

Issue publication date: 23 April 2020

Abstract

Purpose

The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes.

Design/methodology/approach

Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer.

Findings

It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation.

Research limitations/implications

However, detail composition of the fluxes was not further explored for the scope of this paper.

Originality/value

The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.

Keywords

Acknowledgements

The authors would like to acknowledge the financial support provided by Universiti Kebangsaan Malaysia (grant number MI-2018-019) and Ministry of Education, Malaysia (grant number FRGS/1/2019/STG07/UKM/03/1).

Citation

Ismail, N., Jalar, A., Abu Bakar, M., Ismail, R. and Saedi Ibrahim, N. (2020), "Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu", Soldering & Surface Mount Technology, Vol. 32 No. 3, pp. 157-164. https://doi.org/10.1108/SSMT-07-2019-0024

Publisher

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Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited