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A review: effect of copper percentage solder alloy after laser soldering

Asyraf Abdullah (Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pahang, Malaysia)
Siti Rabiatull Aisha Idris (Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pahang, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2022

6

Abstract

Purpose

This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.

Design/methodology/approach

This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.

Findings

This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability.

Research limitations/implications

This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC.

Originality/value

The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.

Keywords

Acknowledgements

The authors would like to thank for the financial support for this work from FRGS/1/2018/TK03/UMP/02/21 (RDU190152) by Ministry of Higher Education for providing the research facilities.

Citation

Abdullah, A. and Aisha Idris, S.R. (2022), "A review: effect of copper percentage solder alloy after laser soldering", Soldering & Surface Mount Technology, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/SSMT-03-2022-0022

Publisher

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Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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