The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder

Abstract

Purpose

This study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder.

Design/methodology/approach

In this paper, a new group of lead-free high-temperature Pb-free solder bearing alloys with five weight percentages of different silver additions, Bi-Ag_x (x = 3.0, 3.5, 4.0, 4.5 and 5.0 Wt.%) have been developed by rapidly solidification processing (RSP) using melt-spun technique as a promising candidate for the replacement of conventional Sn-37Pb common solder. The effect of the addition of a small amount of Ag on the structure, microstructure, thermal and properties of Bi-Ag solder was analyzed by means of X-ray diffractometer, scanning electron microscopy, differential scanning calorimetry and Vickers hardness technique. Applying the RSP commonly results in departures from conventional microstructures, giving an improvement of grain refinement. Furthermore, the grain size of rhombohedral hexagonal phase Bi solid solution and cubic IMC Bi_0.97Ag_0.03 phase is refined by Ag addition. Microstructure analysis of the as soldered revealed that relatively uniform distribution, equiaxed refined grains of secondary IMC Bi_0.97Ag_0.03 particles about 10 µm for Bi-Ag_4.5 dispersed in a Bi matrix. The addition of trace Ag led to a decrease in the solidus and liquidus temperatures of solder, meanwhile, the mushy zone is about 11.4°C and the melting of Sn-Ag_4.5 solder was found to be 261.42°C which is lower compared with the Sn-Ag₃ solder 263.60°C. This means that the silver additions into Bi enhance the melting point. The results indicate that an obvious change in electrical resistivity (?) at room temperature was noticed by the Ag addition. It was also observed that the Vickers microhardness (H_v) was increased with Ag increasing from 118 to 152 MPa. This study recommended the use of the Bi-Ag lead-free solder alloys for higher temperature applications.

Findings

Silver content is very important for the soldering process and solder joint reliability. Based on the present investigations described in this study, several conclusions were found regarding an evaluation of microstructural and mechanical deformation behavior of various Bi-Ag solders. The effect of Ag and rapid solidification on the melting characteristics, and microstructure of Bi-Ag alloys were studied. In addition, the mechanical properties of Bi with different low silver were investigated. From the present experimental study, the following conclusions can be drawn. The addition of Ag had a marked effect on the melting temperature of the lead-free solder alloys, it decreases the melting temperature of the alloy from 263.6 to 261.42°C. Bi-Ag solders are comprised of rhombohedral Hex. Bi solid solution and cubic Ag_0.97Bi_0.03 IMC is formed in the Bi matrix. The alloying of Ag could refine the primary Bi phase and the Bi_0.97Ag_0.03 IMC. With increasing Ag content, the microstructure of the Bi-Ag gradually changes from large dimples into tiny dimple-like structures. The refinement of IMC grains was restrained after silver particles were added into the matrix. The inhibition effect on the growth of IMC grains was most conspicuous when solder was doped with Ag particles. As a result, the Vickers microhardness of the Bi-Ag lead-free solder alloys was enhanced by more than 100% ranging from 118.34 to 252.95 MPa. Bi-Ag high-temperature lead-free solders are a potential candidate for replacing the tin-lead solder (Sn-37Pb) materials which are toxic to human and the environment and has already been banned.

Originality/value

This study recommended the use of the Bi-Ag lead-free solder alloys for high-temperature applications.

Citation

Shalaby, R.M. and Allzeleh, M. (2023), "The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder", Soldering & Surface Mount Technology, Vol. 35 No. 2, pp. 61-69. https://doi.org/10.1108/SSMT-03-2022-0015