Thermal cycling effect on the drop reliability of BGA lead-free solder joints
Abstract
Purpose
The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling.
Design/methodology/approach
The drop test was made with the two kinds of chip samples with the thermal cycling or not. Then, the dyeing process was taken by these samples. Finally, through observing the metallographic analysis results, the conclusions could be found.
Findings
It is observed that the solder joint cracks which were only subjected to drop loads without thermal cycling appeared near the BGA package pads. The solder joint cracks which were subjected to drop loads with thermal cycling appear near the printed circuit board pads.
Originality/value
This paper obtains the solder joint cracks picture with drop test under the thermal cycling.
Keywords
Acknowledgements
The authors would like to deeply thank the Higher School Outstanding Young Scientific and Technological Innovation Team Project of Hubei Province (No. T201607) and the National Natural Science Foundation of China (No. 51775388) for their financial support.
Citation
Liu, F., Zhou, J. and Yan, N. (2017), "Thermal cycling effect on the drop reliability of BGA lead-free solder joints", Soldering & Surface Mount Technology, Vol. 29 No. 4, pp. 199-202. https://doi.org/10.1108/SSMT-03-2017-0007
Publisher
:Emerald Publishing Limited
Copyright © 2017, Emerald Publishing Limited