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Parameter optimization for surface mounter using a self-alignment prediction model

Maitri Mistry (Department of Computer Science and Engineering, Institute of Technology, Nirma University, Ahmedabad, India)
Rahul Gupta (Department of Computer Science and Engineering, Institute of Technology, Nirma University, Ahmedabad, India)
Swati Jain (Department of Computer Science and Engineering, Institute of Technology, Nirma University, Ahmedabad, India)
Jaiprakash V. Verma (Department of Computer Science and Engineering, Institute of Technology, Nirma University, Ahmedabad, India)
Daehan Won (Department of Systems Science and Industrial Engineering, Binghamton University, Binghamton, New York, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 12 July 2022

Issue publication date: 28 February 2023

198

Abstract

Purpose

The purpose of this paper is to develop a machine learning model that predicts the component self-alignment offsets along the length and width of the component and in the angular direction. To find the best performing model, various algorithms like random forest regressor (RFR), support vector regressor (SVR), neural networks (NN), gradient boost (GB) and K-nearest neighbors (KNN) were performed and analyzed. The models were implemented using input features, which can be categorized as solder paste volume, paste-pad offset, component-pad offset, angular offset and orientation.

Design/methodology/approach

Surface-mount technology (SMT) is the technology behind the production of printed circuit boards, which is used in several types of commercial equipment such as communication devices, home appliances, medical imaging systems and sensors. In SMT, components undergo movement known as self-alignment during the reflow process. Although self-alignment is used to decrease the misalignment, it may not work for smaller size chipsets. If the solder paste depositions are not well-aligned, the self-alignment might deteriorate the final alignment of the component.

Findings

It were trained on their targets. Results obtained by each method for each target variable were compared to find the algorithm that gives the best performance. It was found that RFR gives the best performance in case of predicting offsets along the length and width of the component, whereas SVR does so in case of predicting offsets in the angular direction. The scope of this study can be extended to developing this model further to predict defects that can occur during the reflow process. It could also be developed to be used for optimizing the placement process in SMT.

Originality/value

This paper proposes a predictive model that predicts the component self-alignment offsets along the length and width of component and in the angular direction. To find the best performing model, various algorithms like RFR, SVR, NN, GB and KNN were performed and analyzed for predicting the component self-alignment offsets. This helps to achieve the following research objectives: best machine learning model for prediction of component self-alignment offsets. This model can be used to optimize the mounting process in SMT, which reduces occurrences of defects and making the process more efficient.

Keywords

Citation

Mistry, M., Gupta, R., Jain, S., Verma, J.V. and Won, D. (2023), "Parameter optimization for surface mounter using a self-alignment prediction model", Soldering & Surface Mount Technology, Vol. 35 No. 2, pp. 78-85. https://doi.org/10.1108/SSMT-01-2022-0008

Publisher

:

Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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