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Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Shaoyi Liu (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Songjie Yao (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Song Xue (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Benben Wang (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Hui Jin (Aerospace System Engineering Shanghai, Shanghai, China)
Chenghui Pan (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Yinwei Zhang (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Yijiang Zhou (Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China)
Rui Zeng (CETC Wuhu Diamond Aircraft Manufacture Co., Ltd., Wuhu, China)
Lihao Ping (CETC Wuhu Diamond Aircraft Manufacture Co., Ltd., Wuhu, China)
Zhixian Min (CETC No. 38 Research Institute, Hefei, China)
Daxing Zhang (Guangzhou Institute of Technology, Xidian University, Guangzhou, China)
Congsi Wang (Guangzhou Institute of Technology, Xidian University, Guangzhou, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 12 January 2023

Issue publication date: 17 March 2023

67

Abstract

Purpose

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

Design/methodology/approach

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

Findings

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

Originality/value

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

Keywords

Acknowledgements

This work was supported by National Natural Science Foundation of China (51975447, 52275268 and 52005377); National Key Research and Development Program of China (2021YFC2203600); National Defense Basic Scientific Research Program of China (JCKY2021210B007); Wuhu and Xidian University Special Fund for Industry-University-Research Cooperation (XWYCXY-012021012); and Youth Innovation Team of Shaanxi Universities (201926); Natural Science Foundation of Shaanxi Province (2020JQ290).

Citation

Liu, S., Yao, S., Xue, S., Wang, B., Jin, H., Pan, C., Zhang, Y., Zhou, Y., Zeng, R., Ping, L., Min, Z., Zhang, D. and Wang, C. (2023), "Effects of interface cracks on reliability of surface mount technology interconnection in service environment", Microelectronics International, Vol. 40 No. 2, pp. 140-151. https://doi.org/10.1108/MI-10-2022-0183

Publisher

:

Emerald Publishing Limited

Copyright © 2022, Emerald Publishing Limited

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