Effect of different temperature distribution on multi-stack BGA package
Microelectronics International
ISSN: 1356-5362
Article publication date: 26 February 2021
Issue publication date: 17 August 2021
Abstract
Purpose
This paper aims to determine the optimum set of temperatures through correlation study to attain the most effective capillary flow of underfill in a multi-stack ball grid array (BGA) chip device.
Design/methodology/approach
Finite volume method is implemented in the simulation. A three-layer multi-stack BGA is modeled to simulate the underfill flow. The simulated models were well validated with the previous experimental work on underfill process.
Findings
The completion filling time shows high regression R-squared value of up to 0.9918, which indicates a substantial acceleration on the underfill process because of incorporation of thermal delta. An introduction of 11 °C thermal delta to the multi-stacks BGA managed to reduce the filling time by up to 16.4%.
Practical implications
Temperature-induced capillary flow is a relatively new type of driven underfill designed specifically for package on package BGA components. Its simple implementation can further improve the productivity of existing underfill process in the industry that is desirable in reducing the process lead time.
Originality/value
The effect of temperature-induced capillary flow in underfill encapsulation on multi-stacks BGA by means of statistical correlation study is a relatively new topic, which has never been reported in any other research according to the authors’ knowledge.
Keywords
Acknowledgements
This paper was partly supported by the FRGS grant FRGS/1/2015/TK03/USM/03/2 and Short Term Grant 60313020 from the Division of Research and Innovation, Universiti Sains Malaysia (USM). The authors would like to acknowledge the USM Fellowship Award, provided by Institute of Postgraduate Studies (IPS), Universiti Sains Malaysia (USM).
Citation
Tung, L.H., Ng, F.C., Abas, A., Abdullah, M.Z., Samsudin, Z. and Tura Ali, M.Y. (2021), "Effect of different temperature distribution on multi-stack BGA package", Microelectronics International, Vol. 38 No. 2, pp. 33-45. https://doi.org/10.1108/MI-10-2020-0066
Publisher
:Emerald Publishing Limited
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