Hierarchical shape optimization of one-sided transverse flux heating induction coil
ISSN: 0332-1649
Article publication date: 29 November 2019
Issue publication date: 11 March 2020
Abstract
Purpose
The transverse flux heating (TFH) concept offers very high electrical efficiency in combination with unique technological flexibility. Numerous advantages make this method beyond competition to be applied in e.g. processing lines. However, all potential advantages of TFH can be realized in practice only by optimal design of the inductor shape using numerical modelling and optimization techniques. This paper aims to describe a hierarchical approach to the optimal design of a one-sided induction coil, which will be used for one-sided TFH of continuous moving thin metal strip to achieve a homogeneous temperature distribution along the strip width.
Design/methodology/approach
Depending on the design step, 2D or 3D FEM simulations using ANSYS® Mechanical including the electromagnetics package are used. The harmonic electromagnetic solution is coupled to a transient thermal model which takes the strip movement into account. All models use the symmetries of the inductor workpiece arrangement to keep the calculation times as low as possible.
Findings
Due to the geometry of a TFH coil, the models can image a quarter or half of the arrangement. Preliminary investigations of different inductor head shapes can be carried out quickly and then further improved on more complex models in combination with the use of optimization algorithms.
Practical implications
Using hierarchical structure for designing a one-sided TFH coil, offers an efficient and quick way to create a coil which is adapted to the application.
Originality/value
The one-sided inductor design is considered, and the results are generally valid.
Keywords
Citation
Schulze, M., Nikanorov, A. and Nacke, B. (2020), "Hierarchical shape optimization of one-sided transverse flux heating induction coil", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 39 No. 1, pp. 73-80. https://doi.org/10.1108/COMPEL-05-2019-0214
Publisher
:Emerald Publishing Limited
Copyright © 2019, Emerald Publishing Limited