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Low cost prototyping of multichip modules ‐ the European INCO‐Copernicus project

Zsolt Illyefalvi‐Vitéz (Technical University of Budapest, Hungary (TUB.HU))
Alfons Vervaet (IMEC, Belgium (IMEC.BE))
André Van Calster (IMEC, Belgium (IMEC.BE))
Nihal Sinnadurai (TWI, UK (TWI.GB))
Marko Hrovat (Jozef Stefan Institute, University of Llubljana, Slovenia (JSI.SL))
Paul Svasta (University Politehnica of Bucharest, Romania (UPB.RO))
Endre Tóth (Elektroprint Kft., Hungary (EP.HU))
Darko Belavic (HIPOT Hybrid d.o.o., Slovenia (HIPOT.SL))
Radu Mihai Ionescu (RAMELECTRO S.R.L., Romania (SCR.RO))
William Dennehy (William Dennehy Ltd, UK (WD.GB))

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999



The opportunity for mutual benefit across Europe to develop low‐cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in organic and inorganic circuits in countries of Central Europe. As a result, the leading research institutions and small/medium‐size enterprises of Hungary, Romania and Slovenia together with relevant institutions of the UK and Belgium proposed and received approval for a European Union INCO‐Copernicus project “Cheap multichip models” to establish fast prototyping low cost multichip module (MCM) technology facilities. The project commenced in May 1997.



Illyefalvi‐Vitéz, Z., Vervaet, A., Van Calster, A., Sinnadurai, N., Hrovat, M., Svasta, P., Tóth, E., Belavic, D., Mihai Ionescu, R. and Dennehy, W. (1999), "Low cost prototyping of multichip modules ‐ the European INCO‐Copernicus project", Microelectronics International, Vol. 16 No. 2, pp. 13-19.




Copyright © 1999, Company

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