Laser Beam Micro Welding represents an alternative joining technique to the well known soldering processes. Hereby the leads are welded directly to the conducting tracks of the circuit board. The advantages such as high temperature strength, reduced manufacturing time and simplified material separation at the end of the life‐cycle can be used successfully, if the drawbacks such as sensitive process behaviour are well controlled. To obtain this objective, the basic principles of laser beam heating and characteristic process stages of different micro welding scenarios are discussed. Applying simplified solutions of the equation of heat conduction, good parameter sets can be found for different welding applications. These examples show the potential of laser beam welding in the field of microelectronics.
Glasmacher, M. and Pucher, H. (1996), "Laser Beam Micro Welding as a New Interconnection Technique", Microelectronics International, Vol. 13 No. 1, pp. 44-48. https://doi.org/10.1108/13565369610800188Download as .RIS
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