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A comparative study on methods for cleaning copper‐clad boards with abrasive slurries is presented. A number of methods are analysed in detail; the conclusions indicate that brush scrubbing with abrasive slurries offers a wider processing window, whereas jet scrubbing is less ‘forgiving’ for the small/medium‐sized manufacturers where more handling of the material is necessary due to reduced automation. For the larger high volume manufacturers of printed circuit boards with higher levels of automation and tighter process control no significant yield differences were found.

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.